公开(公告)号：US08991713B2

公开(公告)日：2015-03-31

申请号：US13792650

申请日：2013-03-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuya Dokai ,  Koji Shiroki

IPC: G06K19/06 ,  G06K19/07 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/28

CPC classification number: G06K19/0723 ,  G06K19/07786 ,  H01Q1/2225 ,  H01Q7/00 ,  H01Q9/285

Abstract: An RFID chip package includes an RFID chip including a voltage booster circuit and processing an RF signal in a UHF band and a power supply circuit connected to the RFID chip and including at least one inductance element. A reactance component of an input/output impedance at an antenna-connecting input/output terminal of the power supply circuit is substantially 0Ω.

Abstract translation: RFID芯片封装包括包括升压电路和处理UHF频带中的RF信号的RFID芯片和连接到RFID芯片并且包括至少一个电感元件的电源电路。 在电源电路的天线连接输入/输出端子处的输入/输出阻抗的电抗分量基本上为0和OHgr。

公开(公告)号：US09099770B2

公开(公告)日：2015-08-04

申请号：US14047339

申请日：2013-10-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenichi Ishizuka ,  Noboru Kato ,  Koji Shiroki

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/52 ,  H04M1/02 ,  H01Q9/40

CPC classification number: H01Q1/22 ,  H01Q1/243 ,  H01Q1/52 ,  H01Q9/40 ,  H04M1/0277 ,  Y10T29/49018

Abstract: A communication terminal device includes a printed wiring board disposed in a casing, a feed pattern provided on a main surface of the printed wiring board, a radiation plate including a substantially planar radiation portion substantially perpendicular to the main surface of the printed wiring board and a lead portion connecting the radiation portion to the feed pattern, and a component mounted on the main surface of the printed wiring board to overlap the lead portion when the main surface of the printed wiring board is viewed from above, the component including a conductive material, a magnetic material and/or a dielectric material. The radiation portion is connected to the lead portion at a side spaced away from the main surface of the printed wiring board, and an area of the lead portion is located at a predetermined distance from the main surface of the printed wiring board.

Abstract translation: 通信终端装置包括设置在壳体中的印刷布线板，设置在印刷布线板的主表面上的馈送图案，辐射板，其包括基本上垂直于印刷线路板的主表面的大致平面的辐射部分，以及 将辐射部分连接到馈送图案的引线部分，以及当从上方观察印刷电路板的主表面时安装在印刷线路板的主表面上以与引线部分重叠的部件，该部件包括导电材料， 磁性材料和/或介电材料。 辐射部分在与印刷电路板的主表面间隔开的一侧连接到引线部分，并且引线部分的区域位于与印刷线路板的主表面预定距离处。

公开(公告)号：US09070490B2

公开(公告)日：2015-06-30

申请号：US13928720

申请日：2013-06-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koji Shiroki ,  Yoichi Saito ,  Hiromasa Koyama ,  Hirotaka Fujii ,  Noboru Kato

IPC: H01B7/08 ,  H01P3/08 ,  H01P3/06

CPC classification number: H01B7/08 ,  H01P3/06 ,  H01P3/085

Abstract: A transmission line portion of a flat cable that is bent at a position along the longitudinal direction includes a dielectric element body, a first ground conductor, and a second ground conductor. The dielectric element body includes a signal conductor at the middle position of the thickness direction. The first ground conductor includes elongated conductors and bridge conductors. The elongated conductors are spaced in the width direction of the dielectric element body, and extend in the longitudinal direction. The bridge conductors connect the elongated conductors at spacings along the longitudinal direction. The spacing of bridge conductors across the bending point in a bent portion is smaller than the spacing of adjacent bridge conductors located in a straight portion.

Abstract translation: 扁平电缆的沿着纵向位置弯曲的传输线部分包括电介质元件本体，第一接地导体和第二接地导体。 电介质元件主体包括在厚度方向的中间位置处的信号导体。 第一接地导体包括细长导体和桥导体。 细长导体沿电介质元件主体的宽度方向间隔开，并沿纵向方向延伸。 桥导体沿着纵向方向以间隔连接细长导体。 在弯曲部分中跨越弯曲点的桥导体的间隔小于位于直线部分中的相邻桥导体的间隔。

公开(公告)号：US08528829B2

公开(公告)日：2013-09-10

申请号：US13691996

申请日：2012-12-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato ,  Koji Shiroki

IPC: G06K19/06

CPC classification number: G06K19/07786 ,  G06K19/07771 ,  G06K19/07773 ,  G06K19/07775 ,  H01Q1/2208 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H01Q9/0407

Abstract: A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal.

Abstract translation: 无线通信装置包括无线IC器件，电介质基板和金属板。 耦合到无线IC器件的辐射导体设置在电介质基板的前表面上，并且在后表面上设置通过层间连接导体连接到辐射导体的接地导体。 电介质基板通过绝缘粘合剂固定在金属板上，并被导电部件卷曲。 金属板的前表面和背面通过导电构件彼此电连接，并且当从无线IC器件提供高频信号时，在金属板的前表面侧的高频信号电流 通过导电部件和金属板之间的表面边界部分向金属板的背面侧进行放电，作为高频信号照射。

公开(公告)号：US09264011B2

公开(公告)日：2016-02-16

申请号：US14072816

申请日：2013-11-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenichi Ishizuka ,  Noriyuki Ueki ,  Noboru Kato ,  Koji Shiroki

IPC: H01Q9/00 ,  H03H7/38 ,  H04B1/04 ,  H04B1/3827 ,  H03H7/40 ,  H03H7/09 ,  H03H1/00 ,  H01F19/04 ,  H01F27/28

CPC classification number: H03H7/38 ,  H01F19/04 ,  H01F2027/2809 ,  H03H7/09 ,  H03H7/40 ,  H03H2001/0085 ,  H04B1/0458 ,  H04B1/3827

Abstract: An antenna device includes an impedance-matching switching circuit connected to a feeding circuit, and a radiating element. The impedance-matching switching circuit matches the impedance of the radiating element as a second high frequency circuit element and the impedance of the feeding circuit as a first high frequency circuit element. The impedance-matching switching circuit includes a transformer matching circuit and a series active circuit. The transformer matching circuit matches the real parts of the impedance and matches the imaginary parts of the impedance in the series active circuit. Thus, impedance matching is performed over a wide frequency band at a point at which high frequency circuits or elements having different impedances are connected to each other.

Abstract translation: 天线装置包括连接到馈电电路的阻抗匹配切换电路和辐射元件。 阻抗匹配开关电路将作为第二高频电路元件的辐射元件的阻抗和作为第一高频电路元件的馈电电路的阻抗匹配。 阻抗匹配切换电路包括变压器匹配电路和串联有源电路。 变压器匹配电路匹配阻抗的实部，并与串联有源电路中的阻抗的虚部相匹配。 因此，在具有不同阻抗的高频电路或元件彼此连接的点处，在宽频带上执行阻抗匹配。