发明授权
- 专利标题: Method of bonding a metal to a substrate
- 专利标题(中): 将金属键合到基底的方法
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申请号: US13310042申请日: 2011-12-02
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公开(公告)号: US08992696B2公开(公告)日: 2015-03-31
- 发明人: Michael J. Walker , Bob R. Powell, Jr. , Aihua A. Luo
- 申请人: Michael J. Walker , Bob R. Powell, Jr. , Aihua A. Luo
- 申请人地址: US MI Detroit
- 专利权人: GM Global Technology Operations LLC
- 当前专利权人: GM Global Technology Operations LLC
- 当前专利权人地址: US MI Detroit
- 代理机构: Dierker & Associates, P.C.
- 主分类号: C23C22/70
- IPC分类号: C23C22/70 ; C23C22/56 ; B22D19/04 ; C25D11/04
摘要:
A method of bonding a metal to a substrate involves forming a plurality of nano-features in a surface of the substrate, where each nano-feature is chosen from a nano-pore and/or a nano-crevice. In a molten state, the metal is over-cast onto the substrate surface, and penetrates the nano-features. Upon cooling, the metal is solidified inside the nano-features, where the solidification of the metal forms a mechanical interlock between the over-cast metal and the substrate.
公开/授权文献
- US20120301669A1 METHOD OF BONDING A METAL TO A SUBSTRATE 公开/授权日:2012-11-29
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