Invention Grant
- Patent Title: Light emission module, light emission module manufacturing method, and lamp unit
- Patent Title (中): 发光模块，发光模块制造方法和灯单元
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Application No.: US13131736Application Date: 2009-11-25
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Publication No.: US08994051B2Publication Date: 2015-03-31
- Inventor: Hisayoshi Daicho , Tatsuya Matsuura , Yasuaki Tsutsumi , Masanobu Mizuno , Shogo Sugimori
- Applicant: Hisayoshi Daicho , Tatsuya Matsuura , Yasuaki Tsutsumi , Masanobu Mizuno , Shogo Sugimori
- Applicant Address: JP Tokyo
- Assignee: Koito Manufacturing Co., Ltd.
- Current Assignee: Koito Manufacturing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2008-305119 20081128
- International Application: PCT/JP2009/006352 WO 20091125
- International Announcement: WO2010/061592 WO 20100603
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/62 ; F21S8/10 ; H01L33/60
Abstract:
In a light emission module (40), a light wavelength conversion ceramic (52) is formed in a sheet shape which converts the wavelength of the light emitted from a semiconductor light emission element (48) when emitting the light. The light wavelength conversion ceramic (52) has a tapered plane (52a) which is inclined to approach the semiconductor light emission element (48) toward the brim portion. The light wavelength conversion ceramic (52) is transparent and is arranged so that the light emission wavelength band after the conversion has an all ray permeability of 40% or above.
Public/Granted literature
- US20110284902A1 LIGHT EMISSION MODULE, LIGHT EMISSION MODULE MANUFACTURING METHOD, AND LAMP UNIT Public/Granted day:2011-11-24
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