Invention Grant
- Patent Title: Microelectromechanical system and method
- Patent Title (中): 微机电系统及方法
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Application No.: US13834026Application Date: 2013-03-15
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Publication No.: US08994126B2Publication Date: 2015-03-31
- Inventor: Yuval Cohen , Shay Kaplan
- Applicant: Audio Pixels Ltd
- Applicant Address: IL
- Assignee: Audio Pixels Ltd
- Current Assignee: Audio Pixels Ltd
- Current Assignee Address: IL
- Agency: Cantor Colburn LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B3/00 ; B81C1/00

Abstract:
A microelectromechanical system, including a first element and a second element, the first element having a first conductive surface facing a second conductive surface of the second element; wherein at least one of the first element and the second element is operable to constrainedly move nearer and farther from the other element; and at least one insulating separating member which is operable to mechanically maintain a separation between the first surface and the second surface, wherein a minimal distance between a first projection of a first contact area of the insulating separating member and a second projection of a second contact area of the insulating separating member is larger than a minimal separation maintained by the insulating separating member between the first element and the second element.
Public/Granted literature
- US20140264646A1 Microelectromechanical system and method Public/Granted day:2014-09-18
Information query
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