Invention Grant
US08994416B2 Adaptive multi-stage slack borrowing for high performance error resilient computing
有权
用于高性能错误弹性计算的自适应多级松弛借贷
- Patent Title: Adaptive multi-stage slack borrowing for high performance error resilient computing
- Patent Title (中): 用于高性能错误弹性计算的自适应多级松弛借贷
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Application No.: US14045642Application Date: 2013-10-03
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Publication No.: US08994416B2Publication Date: 2015-03-31
- Inventor: Chittoor Parthasarathy , Nitin Chawla , Kallol Chatterjee , Pascal Urard
- Applicant: STMicroelectronics International N.V. , STMicroelectronics SA
- Applicant Address: NL Amsterdam FR Montrouge
- Assignee: STMicroelectronics International N.V.,STMicroelectronics SA
- Current Assignee: STMicroelectronics International N.V.,STMicroelectronics SA
- Current Assignee Address: NL Amsterdam FR Montrouge
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: IN37/DEL/2011 20110107
- Main IPC: H03B19/00
- IPC: H03B19/00 ; H03K3/02 ; H03K3/037

Abstract:
Adaptive scaling digital techniques attempt to place the system close to the timing failure so as to maximize energy efficiency. Rapid recovery from potential failures is usually by slowing the system clock and/or providing razor solutions (instruction replay.) These techniques compromise the throughput. This application presents a technique to provide local in-situ fault resilience based on dynamic slack borrowing. This technique is non-intrusive (needs no architecture modification) and has minimal impact on throughput.
Public/Granted literature
- US20140035644A1 ADAPTIVE MULTI-STAGE SLACK BORROWING FOR HIGH PERFORMANCE ERROR RESILIENT COMPUTING Public/Granted day:2014-02-06
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