Invention Grant
US09000071B2 Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
有权
环氧树脂，包含该环氧树脂的环氧树脂化合物和使用该化合物的辐射热电路板
- Patent Title: Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
- Patent Title (中): 环氧树脂，包含该环氧树脂的环氧树脂化合物和使用该化合物的辐射热电路板
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Application No.: US13872682Application Date: 2013-04-29
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Publication No.: US09000071B2Publication Date: 2015-04-07
- Inventor: Jae Man Park , Hae Yeon Kim , SungBae Moon , Jeungook Park , SungJin Yun , JongHeum Yoon , Hyuk Soo Lee , Jaehun Jeong , In Hee Cho
- Applicant: LG Innotek Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2012-0045842 20120430
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C07D303/46 ; H05K1/05 ; C08G59/28
Abstract:
An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.
Public/Granted literature
- US20130284502A1 EPOXY RESIN, EPOXY RESIN COMPOUND COMPRISING THE SAME, AND RADIANT HEAT CIRCUIT BOARD USING THE COMPOUND Public/Granted day:2013-10-31
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