-
1.发明授权Inorganic filler, resin composition comprising the same and heat radiation substrate using the same 有权无机填料，含有该无机填料的树脂组合物和使用其的散热底物公开(公告)号：US09505914B2
公开(公告)日：2016-11-29
申请号：US14638474
申请日：2015-03-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang A Ju , Hyun Gu Im , Jae Man Park
CPC classification number: C08K9/06 , B05D3/0254 , C08K3/22 , C08K3/38 , C08K9/02 , C08K9/08 , C08K2003/2227 , C08K2003/385 , H01L33/641 , H05K1/0373 , H05K2201/0209 , H05K2201/0227 , C08L63/00
Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
Abstract translation: 根据本发明的一个实施方案的无机填料包括氮化硼附聚物和形成在氮化硼附聚物上并包含-Si-R-NH 2基团的涂层，R选自具有 1至3个碳原子，具有2至3个碳原子的烯烃基和具有2至3个碳原子的炔基。
-
2.发明授权公开(公告)号：US10280289B2
公开(公告)日：2019-05-07
申请号：US15307639
申请日：2015-04-16
Applicant: LG INNOTEK CO., LTD.
Inventor： Jina Gu , Gun Young Gil , Jae Man Park , Sung Jin Yun
Abstract: An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.
-
公开(公告)号：US09468096B2
公开(公告)日：2016-10-11
申请号：US14651783
申请日：2013-12-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Sungjin Yun , Jae Man Park , Jong Heum Yoon , Young Ju Han
IPC: H05K1/05 , B32B15/092 , B32B27/20 , B32B27/26 , B32B27/38 , C08G59/24 , C08G59/50 , C08L63/00 , C08K3/22 , C08K3/38 , H05K1/03
CPC classification number: H05K1/0373 , C08K3/22 , C08K3/38 , C08K2003/2227 , C08K2003/385 , H05K1/056 , H05K2201/0209 , H05K2201/0215 , C08L63/00
Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).
Abstract translation: 根据本发明的一个实施方案，环氧树脂组合物包含环氧化合物，固化剂和无机填料，其中无机填料包括氮化硼（BN）。
-
4.发明授权Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition 有权环氧树脂组合物和使用环氧树脂组合物的绝缘层的印刷电路板公开(公告)号：US09462689B2
公开(公告)日：2016-10-04
申请号：US14647721
申请日：2013-11-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Geon Young Kil , Myeong Jeong Kim , Jae Man Park , Jong Heum Yoon , Jeung Ook Park , Sung Jin Yun , Jong Sik Lee , Sang A. Ju , Yeo Eun Yoon
IPC: H05K1/05 , B32B15/092 , B32B27/20 , B32B27/26 , B32B27/38 , C08L63/00 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/36 , C08K3/38 , H05K1/03 , H01B3/40 , C08G59/50 , C08G59/22 , C08G59/56 , C09K5/14 , C08K3/00 , C08K5/41
CPC classification number: H05K1/0373 , C08G59/226 , C08G59/245 , C08G59/5033 , C08G59/504 , C08G59/56 , C08G2250/00 , C08K3/013 , C08K3/22 , C08K5/41 , C08K2003/2227 , C08L63/00 , C08L2203/20 , C09K5/14 , H01B3/40 , H05K1/056 , H05K2201/0209
Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.
Abstract translation: 根据本发明实施方案的环氧树脂组合物包括环氧化合物，包括二氨基二苯砜和无机填料的固化剂。
-
公开(公告)号：US09445500B2
公开(公告)日：2016-09-13
申请号：US14652031
申请日：2013-12-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Myeong Jeong Kim , Jae Man Park , Jeungook Park , Sungjin Yun , Jong Heum Yoon
IPC: H05K1/05 , B32B15/092 , B23B27/20 , B32B27/26 , B32B27/38 , C08G59/24 , C08G59/50 , C08K3/22 , C08L63/00 , H05K1/03 , C08K3/38 , C09K5/14 , C08G59/22
CPC classification number: H05K1/0373 , C08G59/22 , C08K3/22 , C08K3/38 , C08K2003/2227 , C08K2003/385 , C08L63/00 , C08L2203/20 , C08L2205/025 , C09K5/14
Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).
Abstract translation: 根据本发明的一个实施方案的环氧树脂组合物含有环氧化合物，固化剂和无机填料，其中无机填料含有球形氧化铝（Al 2 O 3）。
-
Patent Agency Ranking
公开(公告)号：US10392499B2
公开(公告)日：2019-08-27
申请号：US15320132
申请日：2015-06-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Jin Yun , Jae Man Park , Hyun Gu Im , Jin A Gu , Gun Young Gil , Se Woong Na , Sang A Ju
IPC: C08K9/02 , C08K3/22 , C08K3/34 , C08K3/38 , C08K9/04 , C08K3/04 , C08K5/55 , C08K9/06 , C08K9/10 , C08L63/00 , H05K1/03 , C01B21/064 , C08G59/02 , C09C1/00 , C09C3/10 , C09C3/12 , H01L23/373 , H01L33/52 , C01B21/082 , C01B21/072
Abstract: An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.
-
7.发明授权公开(公告)号：US09902841B2
公开(公告)日：2018-02-27
申请号：US15587185
申请日：2017-05-04
Applicant: LG Innotek Co., Ltd.
Inventor： Sang A Ju , Hyun Gu Im , Jae Man Park
CPC classification number: C08K9/06 , B05D3/0254 , C08K3/22 , C08K3/38 , C08K9/02 , C08K9/08 , C08K2003/2227 , C08K2003/385 , H01L33/641 , H05K1/0373 , H05K2201/0209 , H05K2201/0227 , C08L63/00
Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
-
8.发明申请EPOXY RESIN COMPOSITE AND PRINTED CIRCUIT BOARD COMPRISING INSULATING LAYER USING THE SAME 审中-公开环氧树脂复合材料和印刷电路板，包括使用绝缘层的绝缘层公开(公告)号：US20170051133A1
公开(公告)日：2017-02-23
申请号：US15307639
申请日：2015-04-16
Applicant: LG INNOTEK CO., LTD.
Inventor： Jina Gu , Gun Young Gil , Jae Man Park , Sung Jin Yun
CPC classification number: C08K9/02 , C08K3/22 , C08K3/38 , C08K2003/2227 , C08K2003/382 , C08L63/00 , H01B3/40 , H05K1/0204 , H05K1/0298 , H05K1/0373 , H05K2201/0209 , H05K2201/0227
Abstract: An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.
Abstract translation: 根据本发明的一个实施方案的环氧树脂组合物包含环氧树脂，固化剂和无机填料，无机填料包括其上形成有金属氧化物膜的氮化硼。
-
公开(公告)号：US11464117B2
公开(公告)日：2022-10-04
申请号：US16651143
申请日：2018-09-18
Applicant: LG INNOTEK CO., LTD.
Inventor： Hee Young Chung , Jae Man Park , Moo Seong Kim
Abstract: A printed circuit board according to one embodiment of the present invention comprises an insulation board and a plurality of metal electrodes disposed on the insulation board, wherein: the plurality of metal electrodes include a first electrode and a second electrode; the first electrode includes a first surface parallel to an upper surface of the insulation board, a second surface facing the first surface, a first side surface disposed between the first surface and the second surface, and a second side surface facing the first side surface; a part of the first side surface and a part of the second side surface protrude toward the outside of the first electrode in the direction parallel to the upper surface of the insulation board; the first side surface protrudes farther in an area adjacent to the first surface than in an area adjacent to the second surface; and the second side surface protrudes farther in the area adjacent to the second surface than in the area adjacent to the first surface.
-
10.发明授权公开(公告)号：US09670340B2
公开(公告)日：2017-06-06
申请号：US15351151
申请日：2016-11-14
Applicant: LG Innotek Co., Ltd.
Inventor： Sang A Ju , Hyun Gu Im , Jae Man Park
CPC classification number: C08K9/06 , B05D3/0254 , C08K3/22 , C08K3/38 , C08K9/02 , C08K9/08 , C08K2003/2227 , C08K2003/385 , H01L33/641 , H05K1/0373 , H05K2201/0209 , H05K2201/0227 , C08L63/00
Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
-
-
-
-
-
-
-
-
-
Search Results
13
records
(took 0.015 seconds)
