Invention Grant
- Patent Title: Apparatus for laser processing
- Patent Title (中): 激光加工设备
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Application No.: US13194958Application Date: 2011-07-31
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Publication No.: US09000326B2Publication Date: 2015-04-07
- Inventor: Yu-Lin Lee , Yung-Hsiang Huang , Tai-Wei Wu , Shun-Han Yang , Gong-Qian Wang
- Applicant: Yu-Lin Lee , Yung-Hsiang Huang , Tai-Wei Wu , Shun-Han Yang , Gong-Qian Wang
- Applicant Address: TW Hsinchu County
- Assignee: Hortek Crystal Co. Ltd.
- Current Assignee: Hortek Crystal Co. Ltd.
- Current Assignee Address: TW Hsinchu County
- Agency: The PL Law Group, PLLC
- Priority: TW99126004A 20100804
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/06 ; G09G3/00 ; B28B17/00 ; B23K26/08 ; B23K26/38 ; B23K26/40 ; H01S3/223

Abstract:
An apparatus for laser processing a board is provided. The apparatus for laser processing a board includes a chip, a laser, a modulating device and a focus device. The chip receives a first frequency signal to generate a second frequency signal. The laser receives the first frequency signal to emit a first laser beam. The modulating device receives the second frequency signal and the first laser beam, and adjusts the first laser beam to emit a second laser beam. The focus device focuses the second laser beam to emit a third laser beam onto the board for forming plural dots on the board.
Public/Granted literature
- US20120034328A1 APPARATUS FOR LASER PROCESSING Public/Granted day:2012-02-09
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