Invention Grant
US09013650B2 Peeling method and method for manufacturing display device using the peeling method
有权
使用剥离方法制造显示装置的剥离方法和方法
- Patent Title: Peeling method and method for manufacturing display device using the peeling method
- Patent Title (中): 使用剥离方法制造显示装置的剥离方法和方法
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Application No.: US14450927Application Date: 2014-08-04
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Publication No.: US09013650B2Publication Date: 2015-04-21
- Inventor: Shunpei Yamazaki , Toru Takayama , Junya Maruyama , Yuugo Goto , Yumiko Ohno
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2003-007612 20030115; JP2003-007629 20030115
- Main IPC: G02F1/136
- IPC: G02F1/136 ; H01L21/70 ; H01L27/12 ; H01L27/32 ; H01L29/786 ; H01L51/00 ; H01L51/56 ; H01L21/02 ; H01L21/28 ; H01L21/324 ; H01L21/425 ; H01L21/8234 ; H01L27/15 ; H01L33/00
Abstract:
The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate.
Public/Granted literature
- US20140339564A1 PEELING METHOD AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE PEELING METHOD Public/Granted day:2014-11-20
Information query
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