Invention Grant
- Patent Title: Consolidated thermal module
- Patent Title (中): 综合散热模块
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Application No.: US14145584Application Date: 2013-12-31
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Publication No.: US09013869B2Publication Date: 2015-04-21
- Inventor: Brett W. Degner , Gregory Tice
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H01L23/40 ; H05K3/30 ; H05K7/12 ; H01L23/473 ; H01L23/427
Abstract:
A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.
Public/Granted literature
- US20140211415A1 CONSOLIDATED THERMAL MODULE Public/Granted day:2014-07-31
Information query
