Invention Grant
- Patent Title: Printed circuit board and method for manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
-
Application No.: US14022611Application Date: 2013-09-10
-
Publication No.: US09013894B2Publication Date: 2015-04-21
- Inventor: Shinya Yamamoto
- Applicant: Fujitsu Component Limited
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2012-202966 20120914
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/09 ; H05K1/00 ; H05K1/16 ; H05K1/11 ; H05K7/10 ; H05K3/42 ; H05K3/40 ; H05K3/34 ; H05K3/38

Abstract:
A printed circuit board includes: a substrate; a land that is disposed on a surface of the substrate, and includes a central portion and a plurality of extended portions, the central portion having the same shape and the same size as a land of a surface mount device, and the extended portions being up-and-down symmetry and right-and-left symmetry with respect to a straight line which passes through the center of the central portion; gaps that are disposed on the surface of the substrate, each of the gaps being disposed on a periphery of the central portion and between the extended portions; and a resist that is disposed on the surface of the substrate, and has an opening portion formed at a position corresponding to the central portion and the gaps.
Public/Granted literature
- US20140076623A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-03-20
Information query