Invention Grant
- Patent Title: Connector assembly and methods with integrated pitch translation
- Patent Title (中): 连接器组件和集成音调翻译的方法
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Application No.: US13826393Application Date: 2013-03-14
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Publication No.: US09017106B2Publication Date: 2015-04-28
- Inventor: Joshua D Heppner , Gaurav Chawla
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Agent Nathan D. Ellefson
- Main IPC: H01R24/86
- IPC: H01R24/86 ; H01R24/60 ; H01R43/00 ; H01R12/72 ; H01R12/79 ; H01R107/00

Abstract:
This disclosure relates generally to a connector assembly. In various examples, first conductive members are secured with respect to one another and form a first row and second conductive members are secured with respect to one another, a first subset of the second conductive members forming a second row and a second subset of the second conductive members forming a third row, the second and third rows being parallel and stacked with respect to one another and the second and third rows being orthogonal to the first row. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding one of contacts. Ones of the first conductive members are arranged to be coupled to a corresponding individual one of the second conductive members proximate a second end of each of the first and second conductive members.
Public/Granted literature
- US20140273662A1 CONNECTOR ASSEMBLY AND METHODS WITH INTEGRATED PITCH TRANSLATION Public/Granted day:2014-09-18
Information query