发明授权
- 专利标题： Methods of forming patterns on a substrate
- 专利标题（中）： 在基材上形成图案的方法
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申请号： US13448438申请日： 2012-04-17
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公开(公告)号： US09018036B2公开(公告)日： 2015-04-28
- 发明人: Joong-hyuk Kim , Sung-gyu Kang , Seung-ho Lee , Jae-woo Chung , Young-ki Hong
- 申请人： Joong-hyuk Kim , Sung-gyu Kang , Seung-ho Lee , Jae-woo Chung , Young-ki Hong
- 申请人地址： KR Gyeonggi-Do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2011-0112497 20111031
- 主分类号： H01L51/40
- IPC分类号： H01L51/40 ; B41J2/16
摘要：
A method of forming patterns on a substrate, the method including: placing a mask having an opening defining a portion of one surface of a substrate on which patterns are to be formed on the substrate; forming a first modification layer in the opening by ejecting a surface modification ink onto a surface of the substrate through the opening; ejecting a target ink having droplets of sizes larger than those of a surface modification ink such that the target ink is distributed on the first modification layer in the opening; and removing the mask.
公开/授权文献
- US20130106942A1 METHODS OF FORMING PATTERNS ON A SUBSTRATE 公开/授权日：2013-05-02
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