Invention Grant
- Patent Title: Protection component and protection device using the same
- Patent Title (中): 保护元件及使用其的保护装置
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Application No.: US13587005Application Date: 2012-08-16
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Publication No.: US09019678B2Publication Date: 2015-04-28
- Inventor: Hsin-Hsien Yeh , Hong-Ching Lin , Tsung-Wen Chen , Wen-Hao Deng
- Applicant: Hsin-Hsien Yeh , Hong-Ching Lin , Tsung-Wen Chen , Wen-Hao Deng
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW100129499A 20110818; TW101123841A 20120703
- Main IPC: H02H5/04
- IPC: H02H5/04 ; H02H3/20 ; H02H7/18 ; H01H85/00 ; H01M10/44 ; H01M10/48 ; H02H3/08 ; H02H9/02 ; H01H85/10 ; H01H85/12
Abstract:
A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
Public/Granted literature
- US20130044401A1 PROTECTION COMPONENT AND PROTECTION DEVICE USING THE SAME Public/Granted day:2013-02-21
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