Disclosed are an apparatus and a method for monitoring a glass plate polishing state. The apparatus may include a location measuring unit for measuring a location on a glass plate being polished by a polishing machine, a current measuring unit for measuring an electric current flowing into the polishing machine, a memory unit for storing a reference value of the electric current flowing into the polishing machine for each polishing location of the glass plate, and a control unit for determining whether a polishing state is faulty, by comparing a value of the electric current measured by the current measuring unit for each polishing location measured by the location measuring unit with a corresponding reference value of the electric current stored in the memory unit for each polishing location.