Invention Grant
- Patent Title: Assembled circuit and electronic component
- Patent Title (中): 组装电路和电子元件
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Application No.: US14094811Application Date: 2013-12-03
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Publication No.: US09030027B2Publication Date: 2015-05-12
- Inventor: Jian-Hong Zeng , Wei Yang , Shou-Yu Hong , Jian-Ping Ying
- Applicant: Delta Electronics, Inc.
- Applicant Address: TW Taoyuan County
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan County
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Priority: TW97100160A 20080103
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H05K7/02 ; H05K1/14 ; H01F17/00 ; H01F17/04 ; H02M3/00 ; H05K3/34

Abstract:
An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.
Public/Granted literature
- US20140085848A1 ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT Public/Granted day:2014-03-27
Information query
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