Invention Grant
- Patent Title: Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same
- Patent Title (中): 各向异性导电胶复合膜及电路连接结构包括相同
-
Application No.: US12974476Application Date: 2010-12-21
-
Publication No.: US09035192B2Publication Date: 2015-05-19
- Inventor: Gyu Ho Lee , Young Woo Park , Il Rae Cho , Young Hun Kim , Kyoung Soo Park , Jin Seong Park , Dong Seon Uh , Kyung Jin Lee , Kwang Jin Jung
- Applicant: Gyu Ho Lee , Young Woo Park , Il Rae Cho , Young Hun Kim , Kyoung Soo Park , Jin Seong Park , Dong Seon Uh , Kyung Jin Lee , Kwang Jin Jung
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee: CHEIL INDUSTRIES, INC.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0131246 20091224
- Main IPC: H05K1/09
- IPC: H05K1/09 ; C09J11/04 ; C09J9/02 ; H05K3/32 ; C08K3/00 ; C08K9/02
Abstract:
An anisotropic conductive adhesive composite and film include a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.
Public/Granted literature
- US20110155430A1 ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITE AND FILM, AND CIRCUIT CONNECTING STRUCTURE INCLUDING THE SAME Public/Granted day:2011-06-30
Information query
