发明授权
- 专利标题: Wide band gap semiconductor wafers grown and processed in a microgravity environment and method of production
- 专利标题(中): 在微重力环境中生长和加工的宽带隙半导体晶片和生产方法
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申请号: US13904918申请日: 2013-05-29
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公开(公告)号: US09041010B2公开(公告)日: 2015-05-26
- 发明人: William F. Seng , Richard L. Glover
- 申请人: William F. Seng , Richard L. Glover
- 代理商 Alberto A. León
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L29/20 ; H01L29/66 ; H01L29/16 ; H01L29/40 ; C30B30/08 ; C30B9/10 ; C30B19/02 ; C30B19/10 ; C30B29/36 ; C30B33/02 ; H01L29/10 ; C30B29/40 ; H01L29/872
摘要:
Wide band gap semiconductor wafers with previously unattainable characteristics and the method of processing and producing the same are disclosed and claimed herein. Specifically, the application discloses and claims a method to process silicon carbide and other similar wide band gap semiconductors in a microgravity environment. The wafers are placed onto stackable containment systems that create an appropriate gap between each wafer to allow for homogeneous heating and processing. The resulting wide band gap semiconductors have unique molecular structures not attainable when wide band gap semiconductors with the identical chemical composition are produced in a standard 1 gravity environment.
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