Invention Grant
US09041144B2 Integrated circuitry comprising transistors with broken up active regions
有权
集成电路包括具有分解的有源区的晶体管
- Patent Title: Integrated circuitry comprising transistors with broken up active regions
- Patent Title (中): 集成电路包括具有分解的有源区的晶体管
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Application No.: US13897047Application Date: 2013-05-17
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Publication No.: US09041144B2Publication Date: 2015-05-26
- Inventor: Michael A. Smith
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L29/78 ; H01L27/092 ; H01L27/088 ; H01L27/085 ; H01L27/06 ; H01L27/115

Abstract:
Some embodiments include integrated circuits having first and second transistors. The first transistor is wider than the second transistor. The first and second transistors have first and second active regions, respectively. Dielectric features are associated with the first active region and break up the first active region. The second active region is not broken up to the same extent as the first active region. Some embodiments include methods of forming transistors. Active areas of first and second transistors are formed. The active area of the first transistor is wider than the active area of the second transistor. Dielectric features are formed in the active area of the first transistor. The active area of the first transistor is broken up to a different extent than the active area of the second transistor. The active areas of the first and second transistors are simultaneously doped.
Public/Granted literature
- US20140339620A1 Integrated Circuitry and Methods of Forming Transistors Public/Granted day:2014-11-20
Information query
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