Invention Grant
- Patent Title: Multilayer ceramic electronic component and method of manufacturing the same
- Patent Title (中): 多层陶瓷电子元件及其制造方法
-
Application No.: US13727420Application Date: 2012-12-26
-
Publication No.: US09042080B2Publication Date: 2015-05-26
- Inventor: Hyo Jung Kim , Seok Hyun Yoon , Chang Hoon Kim , Byoung Hwa Lee , Sang Hoon Kwon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0009539 20120131
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/30 ; H01G4/12 ; H01G13/00 ; H01G4/008

Abstract:
There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (Dc) of ceramic grains in a cover area is smaller than an average diameter (Da) of ceramic grains in the active area, and when a thickness of the cover area is expressed by Tc, 9 um≦Tc≦25 um and Tc/Dc≧55 are satisfied. A multilayer ceramic capacitor having excellent moisture-resistance properties may be obtained.
Public/Granted literature
- US20130194715A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-08-01
Information query