发明授权
- 专利标题： Configurable bevel etcher
- 专利标题（中）： 可配置斜角蚀刻机
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申请号： US13081264申请日： 2011-04-06
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公开(公告)号： US09053925B2公开(公告)日： 2015-06-09
- 发明人: Andrew D. Bailey, III , Alan M. Schoepp , Gregory Sexton , Yunsang Kim , William S. Kennedy
- 申请人： Andrew D. Bailey, III , Alan M. Schoepp , Gregory Sexton , Yunsang Kim , William S. Kennedy
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 代理机构： Buchanan Ingersoll & Rooney PC
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/02 ; H01J37/32 ; H01L21/67
摘要：
A device for cleaning a bevel edge of a semiconductor substrate. The device includes: a lower support having a cylindrical top portion; a lower plasma-exclusion-zone (PEZ) ring surrounding the outer edge of the top portion and adapted to support the substrate; an upper dielectric component opposing the lower support and having a cylindrical bottom portion; an upper PEZ ring surrounding the outer edge of the bottom portion and opposing the lower PEZ ring; and at least one radiofrequency (RF) power source operative to energize process gas into plasma in an annular space defined by the upper and lower PEZ rings, wherein the annular space encloses the bevel edge.
公开/授权文献
- US20110214687A1 CONFIGURABLE BEVEL ETCHER 公开/授权日：2011-09-08
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