发明授权
US09057853B2 Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects
有权
具有用于光电互连的嵌入式3D混合集成的装置
- 专利标题: Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects
- 专利标题(中): 具有用于光电互连的嵌入式3D混合集成的装置
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申请号: US12709279申请日: 2010-02-19
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公开(公告)号: US09057853B2公开(公告)日: 2015-06-16
- 发明人: Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
- 申请人: Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
- 申请人地址: HK Kowloon
- 专利权人: The Hong Kong University of Science and Technology
- 当前专利权人: The Hong Kong University of Science and Technology
- 当前专利权人地址: HK Kowloon
- 代理机构: Leydig, Voit & Mayer, Ltd.
- 主分类号: G02B6/43
- IPC分类号: G02B6/43 ; H05K1/02 ; G02B6/42
摘要:
An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.
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