发明授权
US09057853B2 Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects 有权
具有用于光电互连的嵌入式3D混合集成的装置

Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects
摘要:
An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.
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