公开(公告)号：US08604603B2

公开(公告)日：2013-12-10

申请号：US12709291

申请日：2010-02-19

Applicant: Hon Shing Lau ,  Shi-Wei Lee ,  Matthew Ming Fai Yuen ,  Jingshen Wu ,  Chi Chuen Lo ,  Haibo Fan ,  Haibin Chen

Inventor： Hon Shing Lau ,  Shi-Wei Lee ,  Matthew Ming Fai Yuen ,  Jingshen Wu ,  Chi Chuen Lo ,  Haibo Fan ,  Haibin Chen

IPC: H01L29/72

CPC classification number: H01L23/5384 ,  H01L23/055 ,  H01L23/433 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Abstract translation: 本文描述了具有三维集成电路结构的装置。 该装置包括用于承载多个高功率和低功率芯片的插入器。 高功率芯片被连接并连接到插入器的一侧，而低功率芯片被附接并连接到插入器的另一侧。 一般来说，高功率芯片在运行时产生比低功率芯片更多的热量。 插入器还包括通过硅通孔和用于连接两个表面上的芯片的再分配层。 此外，插入器组件附接并连接到衬底层，衬底层又连接并连接到印刷电路板。 为了提供改进的热管理，承载大功率芯片的插入器表面远离电路板。 散热器附着在大功率芯片的背面以散热。

公开(公告)号：US08039596B2

公开(公告)日：2011-10-18

申请号：US12365638

申请日：2009-02-04

Applicant: Steven Lee Bender ,  Gerald Fries Casperson ,  Dana Dan Hu-Lowe ,  Xin Jiang ,  Gang Li ,  Michael Aidan North ,  Jianying Wang ,  Grant Wickman ,  Peter Brams ,  Haichun Huang ,  Brigitte Devaux ,  Haibin Chen ,  Dawn M. Tanamachi ,  Kristopher Toy ,  Lan Yang ,  Tim W. Sproul ,  Mark Yamanaka

Inventor： Steven Lee Bender ,  Gerald Fries Casperson ,  Dana Dan Hu-Lowe ,  Xin Jiang ,  Gang Li ,  Michael Aidan North ,  Jianying Wang ,  Grant Wickman ,  Peter Brams ,  Haichun Huang ,  Brigitte Devaux ,  Haibin Chen ,  Dawn M. Tanamachi ,  Kristopher Toy ,  Lan Yang ,  Tim W. Sproul ,  Mark Yamanaka

IPC: C07K16/00 ,  C12P21/08 ,  A61K39/395 ,  A61K39/00

CPC classification number: C07K16/2842 ,  A61K2039/505 ,  C07K2317/21 ,  C07K2317/33 ,  C07K2317/52 ,  C07K2317/56 ,  C07K2317/565 ,  C07K2317/567 ,  C07K2317/72 ,  C07K2317/73 ,  C07K2317/732 ,  C07K2317/76 ,  C07K2317/92 ,  C07K2319/30

Abstract: The present disclosure provides isolated monoclonal antibodies, particularly human monoclonal antibodies, or antigen binding portions thereof, that specifically bind to integrin α5β1 with high affinity. Nucleic acid molecules encoding the antibodies of the disclosure, expression vectors, host cells and methods for expressing the antibodies of the disclosure are also provided. Immunoconjugates, bispecific molecules and pharmaceutical compositions comprising the antibodies or antigen binding portions thereof are also provided. The disclosure also provides methods for treating various cancers using the anti-α5β1 antibodies or antigen binding portions thereof described herein.

Abstract translation: 本公开提供以高亲和力特异性结合整联蛋白α5和bgr1的分离的单克隆抗体，特别是人单克隆抗体或其抗原结合部分。 还提供了编码本公开的抗体的核酸分子，表达载体，宿主细胞和用于表达本公开的抗体的方法。 还提供了免疫偶联物，双特异性分子和包含抗体或其抗原结合部分的药物组合物。 本公开还提供了使用本文所述的抗α5和bgr1抗体或其抗原结合部分治疗各种癌症的方法。

公开(公告)号：US07943743B2

公开(公告)日：2011-05-17

申请号：US11917727

申请日：2006-06-30

Applicant: Alan J. Korman ,  Mark J. Selby ,  Changyu Wang ,  Mohan Srinivasan ,  David B. Passmore ,  Haichun Huang ,  Haibin Chen

Inventor： Alan J. Korman ,  Mark J. Selby ,  Changyu Wang ,  Mohan Srinivasan ,  David B. Passmore ,  Haichun Huang ,  Haibin Chen

IPC: C07K16/00

CPC classification number: C07K16/2827 ,  A61K45/06 ,  A61K47/6817 ,  A61K47/6825 ,  A61K47/6849 ,  A61K2039/505 ,  C07K16/28 ,  C07K16/2803 ,  C07K16/2818 ,  C07K2317/21 ,  C07K2317/41 ,  C07K2317/56 ,  C07K2317/567 ,  C07K2317/732 ,  C07K2317/74 ,  C07K2317/75 ,  C07K2317/76 ,  C07K2317/77 ,  C07K2317/92 ,  Y02A50/386 ,  Y02A50/403 ,  Y02A50/407 ,  Y02A50/41 ,  Y02A50/412 ,  Y02A50/466

Abstract: The present disclosure provides isolated monoclonal antibodies, particularly human monoclonal antibodies that specifically bind to PD-L1 with high affinity. Nucleic acid molecules encoding the antibodies of this disclosure, expression vectors, host cells and methods for expressing the antibodies of this disclosure are also provided. Immunoconjugates, bispecific molecules and pharmaceutical compositions comprising the antibodies of the invention are also provided. The disclosure also provides methods for detecting PD-L1, as well as methods for treating various diseases, including cancer and infectious diseases, using anti-PD-L1 antibodies.

Abstract translation: 本公开提供分离的单克隆抗体，特别是以高亲和力特异性结合PD-L1的人单克隆抗体。 还提供了编码本公开的抗体的核酸分子，表达载体，宿主细胞和用于表达本公开的抗体的方法。 还提供了免疫偶联物，双特异性分子和包含本发明抗体的药物组合物。 本公开还提供了使用抗PD-L1抗体检测PD-L1的方法以及用于治疗各种疾病（包括癌症和感染性疾病）的方法。

公开(公告)号：US20100213600A1

公开(公告)日：2010-08-26

申请号：US12709291

申请日：2010-02-19

Applicant: Hon Shing Lau ,  Shi-Wei Lee ,  Matthew Ming Fai Yuen ,  Jingshen Wu ,  Chi Chuen Lo ,  Haibo Fan ,  Haibin Chen

Inventor： Hon Shing Lau ,  Shi-Wei Lee ,  Matthew Ming Fai Yuen ,  Jingshen Wu ,  Chi Chuen Lo ,  Haibo Fan ,  Haibin Chen

IPC: H01L23/34 ,  H01L21/60 ,  H01L23/498

CPC classification number: H01L23/5384 ,  H01L23/055 ,  H01L23/433 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/32 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Abstract translation: 本文描述了具有三维集成电路结构的装置。 该装置包括用于承载多个高功率和低功率芯片的插入器。 高功率芯片被连接并连接到插入器的一侧，而低功率芯片被附接并连接到插入器的另一侧。 一般来说，高功率芯片在运行时产生比低功率芯片更多的热量。 插入器还包括通过硅通孔和用于连接两个表面上的芯片的再分配层。 此外，插入器组件附接并连接到衬底层，衬底层又连接并连接到印刷电路板。 为了提供改进的热管理，承载大功率芯片的插入器表面远离电路板。 散热器附着在大功率芯片的背面以散热。

公开(公告)号：US09057853B2

公开(公告)日：2015-06-16

申请号：US12709279

申请日：2010-02-19

Applicant: Hon Shing Lau ,  Shi-Wei Lee ,  Matthew Ming Fai Yuen ,  Jingshen Wu ,  Chi Chuen Lo ,  Haibo Fan ,  Haibin Chen

Inventor： Hon Shing Lau ,  Shi-Wei Lee ,  Matthew Ming Fai Yuen ,  Jingshen Wu ,  Chi Chuen Lo ,  Haibo Fan ,  Haibin Chen

IPC: G02B6/43 ,  H05K1/02 ,  G02B6/42

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K2201/10121

Abstract: An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Abstract translation: 这里描述了一种光电子器件，包括发射器，接收器和光波导，它们都嵌入在PCB中。 发射机包括激光发生器和用于产生电信号和光信号的其它电路，其通过波导传输到接收器。 接收器包括用于检测和将光信号转换成电信号的电路和检测器。 发射器和接收器的电路和光学部件集成在3D混合芯片组中，其中芯片组件以3D结构堆叠。 由于所有电路和光学元件均嵌入在PCB中，因此该设备非常紧凑，适用于便携式产品。

公开(公告)号：US08981023B2

公开(公告)日：2015-03-17

申请号：US13504098

申请日：2010-10-13

Applicant: Hongping Ren ,  Chuanfeng Li ,  Xiaoli Yao ,  Feng Guo ,  Zhonglin Ma ,  Haibin Chen ,  Kaixiu Wang ,  Jingwei Liu ,  Yaming Wang

Inventor： Hongping Ren ,  Chuanfeng Li ,  Xiaoli Yao ,  Feng Guo ,  Zhonglin Ma ,  Haibin Chen ,  Kaixiu Wang ,  Jingwei Liu ,  Yaming Wang

IPC: C08F4/50 ,  C08F4/52 ,  C08F4/64 ,  C08F4/76 ,  B01J31/38 ,  C08F4/02 ,  C08F10/00

CPC classification number: C08F10/00 ,  C08F4/02 ,  C08F4/6411 ,  C08F4/64127 ,  C08F4/64131 ,  C08F4/64137

Abstract: This invention relates to a supported nonmetallocene catalyst and preparation thereof. The supported nonmetallocene catalyst can be produced with a simple and feasible process and is characterized by an easily controllable polymerization activity. This invention further relates to use of the supported nonmetallocene catalyst in olefin homopolymerization/copolymerization, which is characterized by a lowered assumption of the co-catalyst as compared with the prior art.

公开(公告)号：US20140065164A1

公开(公告)日：2014-03-06

申请号：US14114652

申请日：2012-04-27

Applicant: Allison Y. Luo ,  Wendy L. Trigona ,  Jinshan Shen ,  Li-An Xu ,  Yan Zhang ,  Bruce Stouffer ,  Haibin Chen ,  Haichun Huang ,  Xiaolu Tao ,  Catherine Brockus

Inventor： Allison Y. Luo ,  Wendy L. Trigona ,  Jinshan Shen ,  Li-An Xu ,  Yan Zhang ,  Bruce Stouffer ,  Haibin Chen ,  Haichun Huang ,  Xiaolu Tao ,  Catherine Brockus

IPC: G01N33/68 ,  A61K39/395

CPC classification number: G01N33/686 ,  A61K39/3955 ,  A61K2039/505 ,  C07K16/24 ,  C07K16/4208 ,  C07K2317/21 ,  C07K2317/76 ,  C07K2317/90

Abstract: In certain embodiments, the present invention provides a method of treating an IP10-related disease in a subject, comprising: (a) administering to the subject a predetermined dosage of an anti-IPIO antibody; (b) detecting the level of the anti-IPIO antibody in a sample of the subject; and (c) if the level of the anti-IPIO antibody from step (b) is below a threshold exposure level, increasing the dosage of the anti-IPIO antibody in the subject such that the IP-10 related disease in the subject is treated.

Abstract translation: 在某些实施方案中，本发明提供了治疗受试者中IP10相关疾病的方法，其包括：（a）向受试者施用预定剂量的抗IPIO抗体; （b）检测受试者样品中抗IPIO抗体的水平; 和（c）如果来自步骤（b）的抗IPIO抗体的水平低于临界暴露水平，则增加受试者中抗IPIO抗体的剂量以使受试者中的IP-10相关疾病得到治疗 。

公开(公告)号：US09193957B2

公开(公告)日：2015-11-24

申请号：US13890944

申请日：2013-05-09

Applicant: Haibin Chen ,  Steven J. Collier ,  Jovana Nazor ,  Joly Sukumaran ,  Derek Smith ,  Jeffrey C. Moore ,  Gregory Hughes ,  Jacob Janey ,  Gjalt Huisman ,  Scott Novick ,  Nicholas Agard ,  Oscar Alvizo ,  Gregory Cope ,  Wan Lin Yeo ,  Stefanie Ng Minor

Inventor： Haibin Chen ,  Steven J. Collier ,  Jovana Nazor ,  Joly Sukumaran ,  Derek Smith ,  Jeffrey C. Moore ,  Gregory Hughes ,  Jacob Janey ,  Gjalt Huisman ,  Scott Novick ,  Nicholas Agard ,  Oscar Alvizo ,  Gregory Cope ,  Wan Lin Yeo ,  Stefanie Ng Minor

IPC: C12N9/06 ,  C12P13/00 ,  C12P13/02 ,  C12P13/04 ,  C12P13/06 ,  C12P17/10 ,  C12P17/12 ,  C12P17/16 ,  C12P17/18

CPC classification number: C12P13/02 ,  C12N9/0028 ,  C12P13/001 ,  C12P13/04 ,  C12P13/06 ,  C12P17/10 ,  C12P17/12 ,  C12P17/165 ,  C12P17/185 ,  C12P17/188 ,  C12Y105/01 ,  C12Y105/01023 ,  C12Y105/01024 ,  C12Y105/01028 ,  Y02P20/52

Abstract: The present disclosure provides engineered polypeptides having imine reductase activity, polynucleotides encoding the engineered imine reductases, host cells capable of expressing the engineered imine reductases, and methods of using these engineered polypeptides with a range of ketone and amine substrate compounds to prepare secondary and tertiary amine product compounds.

Abstract translation: 本公开提供了具有亚胺还原酶活性的工程改造的多肽，编码工程改造的亚胺还原酶的多核苷酸，能够表达工程化亚胺还原酶的宿主细胞，以及使用这些工程改造的多肽与一系列酮和胺底物化合物以制备仲胺和叔胺的方法 产品化合物。

公开(公告)号：US08399647B2

公开(公告)日：2013-03-19

申请号：US13237502

申请日：2011-09-20

Applicant: Steven L. Bender ,  Gerald F. Casperson ,  Dana D. Hu-Lowe ,  Xin Jiang ,  Gang Li ,  Michael A. North ,  Jianying Wang ,  Grant Wickman ,  Peter Brams ,  Haichun Huang ,  Brigitte Devaux ,  Haibin Chen ,  Dawn M. Tanamachi ,  Kristopher Toy ,  Lan Yang ,  Tim W. Sproul ,  Mark Yamanaka

Inventor： Steven L. Bender ,  Gerald F. Casperson ,  Dana D. Hu-Lowe ,  Xin Jiang ,  Gang Li ,  Michael A. North ,  Jianying Wang ,  Grant Wickman ,  Peter Brams ,  Haichun Huang ,  Brigitte Devaux ,  Haibin Chen ,  Dawn M. Tanamachi ,  Kristopher Toy ,  Lan Yang ,  Tim W. Sproul ,  Mark Yamanaka

IPC: C07H21/04 ,  C12P21/06 ,  C12N15/87 ,  C12N1/20 ,  C12N15/74

CPC classification number: C07K16/2842 ,  A61K2039/505 ,  C07K2317/21 ,  C07K2317/33 ,  C07K2317/52 ,  C07K2317/56 ,  C07K2317/565 ,  C07K2317/567 ,  C07K2317/72 ,  C07K2317/73 ,  C07K2317/732 ,  C07K2317/76 ,  C07K2317/92 ,  C07K2319/30

Abstract: The present disclosure provides isolated monoclonal antibodies, particularly human monoclonal antibodies, or antigen binding portions thereof, that specifically bind to integrin α5β1 with high affinity. Nucleic acid molecules encoding the antibodies of the disclosure, expression vectors, host cells and methods for expressing the antibodies of the disclosure are also provided. Immunoconjugates, bispecific molecules and pharmaceutical compositions comprising the antibodies or antigen binding portions thereof are also provided. The disclosure also provides methods for treating various cancers using the anti-α5β1 antibodies or antigen binding portions thereof described herein.

Abstract translation: 本公开提供以高亲和力特异性结合整联蛋白α5和bgr1的分离的单克隆抗体，特别是人单克隆抗体或其抗原结合部分。 还提供了编码本公开的抗体的核酸分子，表达载体，宿主细胞和用于表达本公开的抗体的方法。 还提供了免疫偶联物，双特异性分子和包含抗体或其抗原结合部分的药物组合物。 本公开还提供了使用本文所述的抗α5和bgr1抗体或其抗原结合部分治疗各种癌症的方法。

公开(公告)号：US20100330078A1

公开(公告)日：2010-12-30

申请号：US12365638

申请日：2009-02-04

Applicant: STEVEN L. BENDER ,  GERALD F. CASPERSON ,  DANA D. HU-LOWE ,  XIN JIANG ,  GANG LI ,  MICHAEL A. NORTH ,  JIANYING WANG ,  GRANT WICKMAN ,  PETER BRAMS ,  HAICHUN HUANG ,  BRIGITTE DEVAUX ,  HAIBIN CHEN ,  DAWN M. TANAMACHI ,  KRISTOPHER TOY ,  LAN YANG ,  TIM W. SPROUL ,  MARK YAMANAKA

Inventor： STEVEN L. BENDER ,  GERALD F. CASPERSON ,  DANA D. HU-LOWE ,  XIN JIANG ,  GANG LI ,  MICHAEL A. NORTH ,  JIANYING WANG ,  GRANT WICKMAN ,  PETER BRAMS ,  HAICHUN HUANG ,  BRIGITTE DEVAUX ,  HAIBIN CHEN ,  DAWN M. TANAMACHI ,  KRISTOPHER TOY ,  LAN YANG ,  TIM W. SPROUL ,  MARK YAMANAKA

IPC: A61K39/395 ,  C07K16/28 ,  C07K16/00 ,  A61P35/00

CPC classification number: C07K16/2842 ,  A61K2039/505 ,  C07K2317/21 ,  C07K2317/33 ,  C07K2317/52 ,  C07K2317/56 ,  C07K2317/565 ,  C07K2317/567 ,  C07K2317/72 ,  C07K2317/73 ,  C07K2317/732 ,  C07K2317/76 ,  C07K2317/92 ,  C07K2319/30

Abstract: The present disclosure provides isolated monoclonal antibodies, particularly human monoclonal antibodies, or antigen binding portions thereof, that specifically bind to integrin α5β1 with high affinity. Nucleic acid molecules encoding the antibodies of the disclosure, expression vectors, host cells and methods for expressing the antibodies of the disclosure are also provided. Immunoconjugates, bispecific molecules and pharmaceutical compositions comprising the antibodies or antigen binding portions thereof are also provided. The disclosure also provides methods for treating various cancers using the anti-α5β1 antibodies or antigen binding portions thereof described herein.

Abstract translation: 本公开提供以高亲和力特异性结合整联蛋白α5和bgr1的分离的单克隆抗体，特别是人单克隆抗体或其抗原结合部分。 还提供了编码本公开的抗体的核酸分子，表达载体，宿主细胞和用于表达本公开的抗体的方法。 还提供了免疫偶联物，双特异性分子和包含抗体或其抗原结合部分的药物组合物。 本公开还提供了使用本文所述的抗α5和bgr1抗体或其抗原结合部分治疗各种癌症的方法。