发明授权
- 专利标题： Method and apparatus for temporary bonding of ultra thin wafers
- 专利标题（中）： 用于临时粘合超薄晶片的方法和装置
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申请号： US13790684申请日： 2013-03-08
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公开(公告)号： US09064686B2公开(公告)日： 2015-06-23
- 发明人: Gregory George , Stefan Lutter
- 申请人： Gregory George , Stefan Lutter
- 申请人地址： DE Garching
- 专利权人： SUSS MICROTEC LITHOGRAPHY, GmbH
- 当前专利权人： SUSS MICROTEC LITHOGRAPHY, GmbH
- 当前专利权人地址： DE Garching
- 代理机构： AKC Patents LLC
- 代理商 Aliki K. Collins
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/02 ; H01L21/20 ; H01L21/67 ; H01L21/683
摘要：
A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.