发明授权
US09064806B1 Soft and conditionable chemical mechanical polishing pad with window
有权
柔软和有条理的化学机械抛光垫与窗口
- 专利标题： Soft and conditionable chemical mechanical polishing pad with window
- 专利标题（中）： 柔软和有条理的化学机械抛光垫与窗口
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申请号： US14228744申请日： 2014-03-28
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公开(公告)号： US09064806B1公开(公告)日： 2015-06-23
- 发明人: Bainian Qian , Marty W. DeGroot , Michelle Jensen , James Murnane , Jeffrey J. Hendron , John G. Nowland , David B. James , Fengji Yeh
- 申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. , Dow Global Technologies LLC
- 申请人地址： US DE Newark US MI Midland
- 专利权人： Rohm and Haas Electronics Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- 当前专利权人： Rohm and Haas Electronics Materials CMP Holdings, Inc.,Dow Global Technologies LLC
- 当前专利权人地址： US DE Newark US MI Midland
- 代理商 Thomas S. Deibert
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/304 ; B24B37/22
摘要：
A chemical mechanical polishing pad is provided having a polishing layer; and a window incorporated into the polishing layer; wherein the polishing layer comprises a reaction product of ingredients, including: a polishing layer prepolymer and a polishing layer curative system; wherein the polishing layer curative system includes a polishing layer amine initiated polyol curative, a polishing layer high molecular weight polyol curative and a polishing layer difunctional curative; and, wherein the window comprises a reaction product of ingredients, including: a window prepolymer and a window curative system; wherein the window curative system includes a window difunctional curative, a window amine initiated polyol curative and a window high molecular weight polyol curative; and, wherein the polishing layer exhibits a density of ≧0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr.
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