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    Soft and conditionable chemical mechanical polishing pad with window
    3.
    发明授权
    Soft and conditionable chemical mechanical polishing pad with window 有权
    柔软和有条理的化学机械抛光垫与窗口

    公开(公告)号：US09064806B1

    公开(公告)日：2015-06-23

    申请号：US14228744

    申请日：2014-03-28

    申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. ,  Dow Global Technologies LLC

    发明人： Bainian Qian ,  Marty W. DeGroot ,  Michelle Jensen ,  James Murnane ,  Jeffrey J. Hendron ,  John G. Nowland ,  David B. James ,  Fengji Yeh

    IPC分类号： H01L21/302 ,  H01L21/304 ,  B24B37/22

    CPC分类号： H01L21/304 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24

    摘要： A chemical mechanical polishing pad is provided having a polishing layer; and a window incorporated into the polishing layer; wherein the polishing layer comprises a reaction product of ingredients, including: a polishing layer prepolymer and a polishing layer curative system; wherein the polishing layer curative system includes a polishing layer amine initiated polyol curative, a polishing layer high molecular weight polyol curative and a polishing layer difunctional curative; and, wherein the window comprises a reaction product of ingredients, including: a window prepolymer and a window curative system; wherein the window curative system includes a window difunctional curative, a window amine initiated polyol curative and a window high molecular weight polyol curative; and, wherein the polishing layer exhibits a density of ≧0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr.

    摘要翻译： 提供具有抛光层的化学机械抛光垫; 和结合到抛光层中的窗口; 其中抛光层包括成分的反应产物，其包括：抛光层预聚物和抛光层固化体系; 其中所述抛光层固化剂体系包括抛光层胺引发的多元醇固化剂，抛光层高分子量多元醇固化剂和抛光层双官能化剂; 并且其中所述窗口包括成分的反应产物，所述反应产物包括：窗预处理剂和窗口固化剂体系; 其中所述窗口治疗系统包括窗口双功能固化剂，窗胺引发的多元醇固化剂和窗口高分子量多元醇固化剂; 并且其中所述抛光层的密度为≥0.6g/ cm 3; 肖氏D硬度为5〜40; 100％至450％的断裂伸长率; 切割速度为25〜150μm/ hr。

    Soft And Conditionable Chemical Mechanical Polishing Pad Stack
    4.
    发明申请
    Soft And Conditionable Chemical Mechanical Polishing Pad Stack 有权
    软化学机械抛光垫堆叠

    公开(公告)号：US20140357169A1

    公开(公告)日：2014-12-04

    申请号：US13906715

    申请日：2013-05-31

    申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials CMP Holdings, Inc.

    发明人： James Murnane ,  Bainian Qian ,  John G. Nowland ,  Michelle K. Jensen ,  Jeffrey James Hendron ,  Marty W. DeGroot ,  David B. James ,  Fengji Yeh

    IPC分类号： B24B37/24 ,  B24B37/20

    CPC分类号： B24B37/245 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  C08G18/3278 ,  C08G18/6644

    摘要： A chemical mechanical polishing pad stack is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate.

    摘要翻译： 提供一种化学机械抛光垫叠层，包括：抛光层; 刚性层 以及将所述研磨层粘合到所述刚性层的热熔粘合剂; 其中抛光层包括成分的反应产物，包括：多官能异氰酸酯; 和一个治疗包; 其中所述固化剂包含胺引发的多元醇固化剂和高分子量多元醇固化剂; 其中所述抛光层的密度大于0.6g / cm 3; 肖氏D硬度为5〜40; 100％至450％的断裂伸长率; 切割速度为25〜150μm/ hr; 并且其中所述抛光层具有适于抛光所述基底的抛光表面。

    METHOD OF CHEMICAL MECHANICAL POLISHING A SUBSTRATE
    7.
    发明申请
    METHOD OF CHEMICAL MECHANICAL POLISHING A SUBSTRATE 有权
    化学机械抛光方法

    公开(公告)号：US20150065014A1

    公开(公告)日：2015-03-05

    申请号：US14014498

    申请日：2013-08-30

    申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials CMP Holdings, Inc.

    发明人： Michelle Jensen ,  Bainian Qian ,  Fengji Yeh ,  Marty W. DeGroot ,  Mohammad T. Islam ,  Matthew Richard Van Hanehem ,  Darrell String ,  James Murnane ,  Jeffrey James Hendron ,  John G. Nowland

    IPC分类号： B24B37/24 ,  B24B37/22 ,  B24B37/20

    CPC分类号： B24B37/24 ,  B24B1/00 ,  B24B37/205 ,  B24B37/22 ,  C08G18/10 ,  H01L21/30625 ,  H01L21/3212

    摘要： A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.

    摘要翻译： 提供了一种化学机械抛光衬底的方法，包括：提供衬底; 提供一种化学机械抛光垫，包括：具有组成和抛光表面的抛光层，其中选择抛光层的组成以显示初始水解稳定性; 加上持续的水解不稳定性; 具有顶表面和底表面的刚性层; 插入在抛光层的基面和刚性层的顶表面之间的热熔胶; 其中所述热熔粘合剂将所述抛光层粘合到所述刚性层; 具有堆叠侧和压板侧的压敏压板粘合剂层; 其中压敏压板粘合剂层的堆叠侧与刚性层的底表面相邻; 并且在抛光表面和衬底之间产生动态接触以抛光衬底的表面。

    Soft and conditionable chemical mechanical window polishing pad
    9.
    发明授权
    Soft and conditionable chemical mechanical window polishing pad 有权
    柔软化妆机械窗玻璃抛光垫

    公开(公告)号：US09238295B2

    公开(公告)日：2016-01-19

    申请号：US13906765

    申请日：2013-05-31

    申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. ,  Dow Global Technologies LLC

    发明人： Bainian Qian ,  Michelle K. Jensen ,  Marty W. DeGroot ,  Angus Repper ,  James Murnane ,  Jeffrey James Hendron ,  John G. Nowland ,  David B. James ,  Fengji Yeh

    IPC分类号： B24B37/24 ,  C08G18/32 ,  C08G18/66 ,  B24D11/00 ,  B24B37/20 ,  B24B37/22

    CPC分类号： B24B37/245 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D11/001 ,  C08G18/3278 ,  C08G18/6644

    摘要： A chemical mechanical polishing pad is provided containing: a polishing layer; a plug in place endpoint detection window block; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad.

    摘要翻译： 提供化学机械抛光垫，其包含：抛光层; 一个插件到位端点检测窗口块; 刚性层 以及将所述研磨层粘合到所述刚性层的热熔粘合剂; 其中抛光层包括成分的反应产物，包括：多官能异氰酸酯; 和一个治疗包; 其中所述固化剂包含胺引发的多元醇固化剂和高分子量多元醇固化剂; 其中所述抛光层的密度大于0.6g / cm 3; 肖氏D硬度为5〜40; 100％至450％的断裂伸长率; 切割速度为25〜150μm/ hr; 并且其中所述抛光层具有适于抛光所述基底的抛光表面。 还提供制造和使用化学机械抛光垫的方法。

    Method of chemical mechanical polishing a substrate
    10.
    发明授权
    Method of chemical mechanical polishing a substrate 有权
    化学机械抛光底物的方法

    公开(公告)号：US09102034B2

    公开(公告)日：2015-08-11

    申请号：US14014498

    申请日：2013-08-30

    申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. ,  Dow Global Technologies LLC

    发明人： Michelle Jensen ,  Bainian Qian ,  Fengji Yeh ,  Marty W. DeGroot ,  Mohammad T. Islam ,  Matthew Richard Van Hanehem ,  Darrell String ,  James Murnane ,  Jeffrey James Hendron ,  John G. Nowland

    IPC分类号： B24B37/24 ,  B24B1/00 ,  C08G18/10 ,  H01L21/321 ,  H01L21/306 ,  B24B37/20 ,  B24B37/22

    CPC分类号： B24B37/24 ,  B24B1/00 ,  B24B37/205 ,  B24B37/22 ,  C08G18/10 ,  H01L21/30625 ,  H01L21/3212

    摘要： A method of chemical mechanical polishing a substrate is provided, including: providing a substrate; providing a chemical mechanical polishing pad, comprising: a polishing layer having a composition and a polishing surface, wherein the composition of polishing layer is selected to exhibit an initial hydrolytic stability; coupled with a sustained hydrolytic instability; a rigid layer having a top surface and a bottom surface; a hot melt adhesive interposed between the base surface of the polishing layer and the top surface of the rigid layer; wherein the hot melt adhesive bonds the polishing layer to the rigid layer; a pressure sensitive platen adhesive layer having a stack side and a platen side; wherein the stack side of the pressure sensitive platen adhesive layer is adjacent to the bottom surface of the rigid layer; and, creating dynamic contact between the polishing surface and substrate to polish a surface of the substrate.

    摘要翻译： 提供了一种化学机械抛光衬底的方法，包括：提供衬底; 提供一种化学机械抛光垫，包括：具有组成和抛光表面的抛光层，其中选择抛光层的组成以显示初始水解稳定性; 加上持续的水解不稳定性; 具有顶表面和底表面的刚性层; 插入在抛光层的基面和刚性层的顶表面之间的热熔胶; 其中所述热熔粘合剂将所述抛光层粘合到所述刚性层; 具有堆叠侧和压板侧的压敏压板粘合剂层; 其中压敏压板粘合剂层的堆叠侧与刚性层的底表面相邻; 并且在抛光表面和衬底之间产生动态接触以抛光衬底的表面。