发明授权
- 专利标题： Heating device, substrate processing apparatus, and method of manufacturing semiconductor device
- 专利标题（中）： 加热装置，基板处理装置以及半导体装置的制造方法
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申请号： US12838831申请日： 2010-07-19
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公开(公告)号： US09064912B2公开(公告)日： 2015-06-23
- 发明人: Hitoshi Murata , Tetsuya Kosugi , Shinobu Sugiura , Masaaki Ueno
- 申请人： Hitoshi Murata , Tetsuya Kosugi , Shinobu Sugiura , Masaaki Ueno
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Kokusai Electric, Inc.
- 当前专利权人： Hitachi Kokusai Electric, Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Brundidge & Stanger, P.C.
- 优先权： JP2009-169938 20090721; JP2010-145457 20100625
- 主分类号： H05B3/02
- IPC分类号： H05B3/02 ; H05B3/06 ; H01L21/26 ; H01L21/67
摘要：
A heating device includes: a heating element including a mountain part and a valley part alternately connected in plurality to form a meander shape, and a holding body receiving part an end of the valley part, where a width of the holding body receiving part is greater than that of the valley part; an insulating body installed at an outer circumference of the heating element with both ends of the heating element fixed thereto; and a staple pin penetrating the holding body receiving part and a neighboring holdings body receiving part to fix the heating element to the insulating body, where the staple pin is dislocated with respect to a center of the holding body receiving part and an amount of dislocation of the staple pin varies according to a distance between the holding body receiving part and the both ends.
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