发明授权
US09066433B2 Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
有权
功率模块基板，带散热片的功率模块基板，功率模块，以及制造功率模块基板的方法
- 专利标题： Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
- 专利标题（中）： 功率模块基板，带散热片的功率模块基板，功率模块，以及制造功率模块基板的方法
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申请号： US14238097申请日： 2012-08-10
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公开(公告)号： US09066433B2公开(公告)日： 2015-06-23
- 发明人: Yoshirou Kuromitsu , Yoshiyuki Nagatomo , Nobuyuki Terasaki , Toshio Sakamoto , Kazunari Maki , Hiroyuki Mori , Isao Arai
- 申请人： Yoshirou Kuromitsu , Yoshiyuki Nagatomo , Nobuyuki Terasaki , Toshio Sakamoto , Kazunari Maki , Hiroyuki Mori , Isao Arai
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI MATERIALS CORPORATION
- 当前专利权人： MITSUBISHI MATERIALS CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Locke Lord LLP
- 代理商 James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- 优先权： JP2011-176712 20110812; JP2011-176881 20110812
- 国际申请： PCT/JP2012/070484 WO 20120810
- 国际公布： WO2013/024813 WO 20130221
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/34 ; H05K3/10 ; H01L23/373 ; H05K1/09 ; H05K3/38 ; H05K1/02 ; C04B35/645 ; C04B37/02 ; H05K1/03 ; H05K3/00 ; H01L23/00
摘要：
A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.
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