Invention Grant
- Patent Title: Wiring board and method for manufacturing the same
- Patent Title (中): 接线板及其制造方法
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Application No.: US13483587Application Date: 2012-05-30
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Publication No.: US09066439B2Publication Date: 2015-06-23
- Inventor: Hiroshi Segawa , Nobuyuki Naganuma , Michimasa Takahashi , Teruyuki Ishihara
- Applicant: Hiroshi Segawa , Nobuyuki Naganuma , Michimasa Takahashi , Teruyuki Ishihara
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K3/30 ; H05K3/36 ; H05K1/14 ; H05K3/34
Abstract:
A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.
Public/Granted literature
- US20130014982A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-01-17
Information query
