Invention Grant
US09074113B2 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
有权
用于倒装芯片型半导体背表面的薄膜，用于半导体背表面的切割带集成薄膜，用于制造半导体器件的工艺和倒装芯片型半导体器件
- Patent Title: Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
- Patent Title (中): 用于倒装芯片型半导体背表面的薄膜，用于半导体背表面的切割带集成薄膜，用于制造半导体器件的工艺和倒装芯片型半导体器件
-
Application No.: US13184994Application Date: 2011-07-18
-
Publication No.: US09074113B2Publication Date: 2015-07-07
- Inventor: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- Applicant: Naohide Takamoto , Goji Shiga , Fumiteru Asai
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JPP2010-163052 20100720
- Main IPC: H01L23/48
- IPC: H01L23/48 ; C09J163/00
Abstract:
The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.
Public/Granted literature
Information query
IPC分类:
