Invention Grant
US09079014B2 Connector module assemblies, methods, and components for implantable medical electrical devices
有权
用于可植入医疗电气设备的连接器模块组件，方法和部件
- Patent Title: Connector module assemblies, methods, and components for implantable medical electrical devices
- Patent Title (中): 用于可植入医疗电气设备的连接器模块组件，方法和部件
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Application No.: US14153109Application Date: 2014-01-13
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Publication No.: US09079014B2Publication Date: 2015-07-14
- Inventor: Andrew J. Ries , Jeevan M. Prasannakumar , Richard P. Nelson
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Evans M. Mburu
- Main IPC: H01R13/405
- IPC: H01R13/405 ; A61N1/05 ; H01R43/24 ; A61N1/375 ; H01Q1/27 ; H01R103/00 ; H01R4/02 ; H01R4/34 ; H01R24/58
Abstract:
A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
Public/Granted literature
- US20140123490A1 CONNECTOR MODULE ASSEMBLIES, METHODS, AND COMPONENTS FOR IMPLANTABLE MEDICAL ELECTRICAL DEVICES Public/Granted day:2014-05-08
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