Invention Grant
- Patent Title: Joint structures having organic preservative films
- Patent Title (中): 具有有机防腐膜的接头结构
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Application No.: US13535766Application Date: 2012-06-28
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Publication No.: US09082680B2Publication Date: 2015-07-14
- Inventor: Ju-Il Choi , Jeong-Gi Jin , Ui-Hyoung Lee , Hyung-Seok Kim , Jeong-Woo Park
- Applicant: Ju-Il Choi , Jeong-Gi Jin , Ui-Hyoung Lee , Hyung-Seok Kim , Jeong-Woo Park
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2011-0063795 20110629
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/18 ; H01L23/00 ; H05K3/34 ; B23K1/00 ; H01L25/065 ; H01L25/10 ; H05K3/40 ; H01L23/31
Abstract:
The inventive concept provides methods for inhibiting the formation of one or more oxides on metal bumps during the formation of solder joint structures and solder joint structures including one or more preservative films. In some embodiments, the solder joint structure includes a metal bump having a preservative film disposed on the surface thereof.
Public/Granted literature
- US20130000978A1 Joint Structures Having Organic Preservative Films Public/Granted day:2013-01-03
Information query
