Invention Grant
US09082843B2 Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
有权
具有阶梯形边缘端接的半导体器件,以及半导体器件的制造方法
- Patent Title: Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
- Patent Title (中): 具有阶梯形边缘端接的半导体器件,以及半导体器件的制造方法
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Application No.: US13713867Application Date: 2012-12-13
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Publication No.: US09082843B2Publication Date: 2015-07-14
- Inventor: Gerhard Schmidt
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/861 ; H01L29/06 ; H01L29/739 ; H01L21/265 ; H01L29/20

Abstract:
A semiconductor body has a first side, second side, lateral edge, active area, edge termination between the active area and the lateral edge, and drift region of a first conductivity type. The edge termination includes a step formed in the semiconductor body between the first side and the lateral edge. The step includes a lateral surface extending up to the first side and a bottom surface extending up to the lateral edge. A first doping zone of a second conductivity type is formed in the semiconductor body along the lateral surface of the step and forms a pn-junction with the drift region. A second doping zone of the first conductivity type is formed in the semiconductor body at least along a part of the bottom surface of the step and extends up to the lateral edge, wherein the second doping zone is in contact with the drift region.
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