Invention Grant
US09084360B2 Electronic device assemblies including conductive vias having two or more conductive elements
有权
电子设备组件包括具有两个或多个导电元件的导电通孔
- Patent Title: Electronic device assemblies including conductive vias having two or more conductive elements
- Patent Title (中): 电子设备组件包括具有两个或多个导电元件的导电通孔
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Application No.: US13866713Application Date: 2013-04-19
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Publication No.: US09084360B2Publication Date: 2015-07-14
- Inventor: David J. Corisis , Choon Kuan Lee , Chin Hui Chong
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Priority: SG200601114-2 20060220
- Main IPC: H05K1/11
- IPC: H05K1/11 ; G01R31/02 ; H05K1/02 ; H01L21/48 ; H01L21/768 ; H01L23/48 ; H01L23/498 ; H01L23/66 ; G06F1/16 ; H05K1/18 ; H05K3/42

Abstract:
Electronic devices include a substrate with first and second pairs of conductive traces extending in or on the substrate. A first conductive interconnecting member extends through a hole in the substrate and communicates electrically with a first trace of each of the first and second pairs, while a second conductive interconnecting member extends through the hole and communicates electrically with the second trace of each of the first and second pairs. The first and second interconnecting members are separated from one another by a distance substantially equal to a distance separating the conductive traces in each pair. Electronic device assemblies include a transmitting device configured to transmit a differential signal through a conductive structure to a receiving device. The conductive structure includes first and second pair of conductive traces with first and second interconnecting members providing electrical communication therebetween.
Public/Granted literature
- US20130235517A1 ELECTRONIC DEVICE ASSEMBLIES INCLUDING CONDUCTIVE VIAS HAVING TWO OR MORE CONDUCTIVE ELEMENTS Public/Granted day:2013-09-12
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