发明授权
- 专利标题: Thermally conductive adhesive
- 专利标题(中): 导热胶
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申请号: US13978600申请日: 2011-12-15
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公开(公告)号: US09084373B2公开(公告)日: 2015-07-14
- 发明人: Taichi Koyama , Takayuki Saito
- 申请人: Taichi Koyama , Takayuki Saito
- 申请人地址: JP Tokyo
- 专利权人: DEXERIALS CORPORATION
- 当前专利权人: DEXERIALS CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JP2011-037904 20110224
- 国际申请: PCT/JP2011/078988 WO 20111215
- 国际公布: WO2012/114613 WO 20120830
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; C09J9/00 ; H01L23/373 ; C09J11/04 ; H01L23/00 ; C08K3/08
摘要:
A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.
公开/授权文献
- US20130279118A1 THERMALLY CONDUCTIVE ADHESIVE 公开/授权日:2013-10-24