发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13099804申请日: 2011-05-03
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公开(公告)号: US09093402B2公开(公告)日: 2015-07-28
- 发明人: Masayuki Sakakura , Takeshi Noda , Hideaki Kuwabara , Shunpei Yamazaki
- 申请人: Masayuki Sakakura , Takeshi Noda , Hideaki Kuwabara , Shunpei Yamazaki
- 申请人地址: JP
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Husch Blackwell LLP
- 优先权: JP2005-043102 20050218
- 主分类号: H01L51/00
- IPC分类号: H01L51/00 ; H01L27/32 ; H01L51/50 ; H01L51/52 ; H01L51/56
摘要:
A manufacturing method of an active matrix light emitting device in which the active matrix light emitting device can be manufactured in a shorter time with high yield at low cost compared with conventional ones will be provided. It is a feature of the present invention that a layered structure is employed for a metal electrode which is formed in contact with or is electrically connected to a semiconductor layer of each TFT arranged in a pixel area of an active matrix light emitting device. Further, the metal electrode is partially etched and used as a first electrode of a light emitting element. A buffer layer, a layer containing an organic compound, and a second electrode layer are stacked over the first electrode.
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