Invention Grant
- Patent Title: Method of etching MTJ using CO process chemistries
- Patent Title (中): 使用CO工艺化学品蚀刻MTJ的方法
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Application No.: US13214107Application Date: 2011-08-19
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Publication No.: US09105569B2Publication Date: 2015-08-11
- Inventor: Krishnakumar Mani , Benjamin Chen
- Applicant: Krishnakumar Mani , Benjamin Chen
- Applicant Address: US DE Wilmington
- Assignee: III Holdings 1, LLC
- Current Assignee: III Holdings 1, LLC
- Current Assignee Address: US DE Wilmington
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L43/12
- IPC: H01L43/12 ; H01L27/22

Abstract:
A method for fabricating a magnetic film structure is provided. The method comprises forming a magnetic structure on a bottom electrode layer, the magnetic structure comprising at least one pinned bottom magnetic film layer having a fixed magnetic orientation; at least one top magnetic film layer whose magnetic orientation can be manipulated by a current; and a tunneling layer between the bottom magnetic film layer and the top magnetic film layer; forming a metallic hard mask atop the magnetic structure; patterning and etching the metallic hard mask to define exposed areas of the magnetic structure; selectively etching the exposed areas of the magnetic structure by a chemical etch process based on a CO etch chemistry to form discrete magnetic bits.
Public/Granted literature
- US20140256061A1 Method of Etching MTJ Using CO Process Chemistries Public/Granted day:2014-09-11
Information query
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