Abstract:
Integrated circuit comprising a sensing unit that includes a sensing circuit, two conductors and a magnetic storage element. The sensing circuit monitors a voltage drop across the element when a current is passed between the conductors with the element in between. The voltage drop is pre-calibrated to indicate a change in conductivity in the element that is caused by an external magnetic field. Advantageously, this indication is usable particularly for assessing a possible data corruption in a magnetic memory circuit in the integrated circuit, due to stray and external magnetic fields. Methods of using the sensing unit are also proposed.
Abstract:
A method for fabricating a magnetic film structure is provided. The method comprises forming a magnetic structure on a bottom electrode layer, the magnetic structure comprising at least one pinned bottom magnetic film layer having a fixed magnetic orientation; at least one top magnetic film layer whose magnetic orientation can be manipulated by a current; and a tunneling layer between the bottom magnetic film layer and the top magnetic film layer; forming a metallic hard mask atop the magnetic structure; patterning and etching the metallic hard mask to define exposed areas of the magnetic structure; selectively etching the exposed areas of the magnetic structure by a chemical etch process based on a CO etch chemistry to form discrete magnetic bits.
Abstract:
In one embodiment there is provided, a display driver system, comprising, at least one display driver; a magnetic random access memory (MRAM) macro; and a display driver interface coupling the MRAM macro and the at least one display driver.
Abstract:
Disclosed is a nonvolatile magnetic memory cell, comprising: a) a switchable magnetic element; b) a word line and a bit line to energize the switchable magnetic element; and c) a magnetic field boosting material positioned adjacent to at least one of the word line and the bit line to boost a magnetic field generated by current flowing therein.
Abstract:
A semiconductor integrated circuit comprising a first circuit area for a low voltage operation and a second circuit area for a high voltage operation. The circuit areas comprise two vertically stacked backend patterned metal layers that are separated by an inter-metallic dielectric (IMD). The two metal layers and the IMD form a combination that is operable at the low voltage. The first circuit area uses a first portion of the combination for operating at the low voltage and the second circuit area uses a second portion of the combination for routing at the high voltage, the two metal layers in the second portion being interconnected through the IMD by via hole, for withstanding the high voltage. The first portion may comprise an array of magnetic random access memory (MRAM) devices and the second circuit area may comprise a display drive circuit.
Abstract:
Embodiments of the invention magnetic memory device, comprising: a magnetic tunnel junction (MTJ) which includes a first free layer optimized for reading; and a second free layer separate from the MTJ and optimized for writing.
Abstract:
Integrated circuit comprising a sensing unit that includes a sensing circuit, two conductors and a magnetic storage element. The sensing circuit monitors a voltage drop across the element when a current is passed between the conductors with the element in between. The voltage drop is pre-calibrated to indicate a change in conductivity in the element that is caused by an external magnetic field. Advantageously, this indication is usable particularly for assessing a possible data corruption in a magnetic memory circuit in the integrated circuit, due to stray and external magnetic fields. Methods of using the sensing unit are also proposed.
Abstract:
Memory circuit comprising an addressable magnetic tunnel junction (MTJ) stack, forming a magnetic storage element in the circuit. The MTJ stack comprises a tunnel oxide layer between a free layer and a fixed layer. A stress inducing layer is disposed adjacent to the free layer to provide tensile or compressive stress to the free layer, in order to manipulate a magnetic field that is required to write a bit into the MTJ stack. Method of using the memory circuit is also proposed.
Abstract:
Memory cell comprising two conductors, with a serially connected magnetic storage element and a Schottky diode between the two conductors. The Schottky diode provides a unidirectional conductive path between the two conductors and through the element. The Schottky diode is formed between a metal layer in one of the two conductors and a processed junction layer. Methods for process and for operation of the memory cell are also disclosed. The memory cell using the Schottky diode can be designed for high speed operation and with high density of integration. Advantageously, the junction layer can also be used as a hard mask for defining the individual magnetic storage element in the memory cell. The memory cell is particularly useful for magnetic random access memory (MRAM) circuits.
Abstract:
A method for fabricating a circuit, by defining a first set of resist features on a substrate and corresponding to a first mask layout, followed by defining a second set of resist features on the substrate corresponding to a second mask layout, wherein the second set adds to the first set for rectifying an error in either mask layout. In another aspect, the method is by defining a first set of resist features on a substrate and corresponding to a first mask layout that has an error, etching the substrate while the first set protects selected regions, defining a second set of resist features on the substrate and corresponding to a second mask layout, followed by etching the substrate to selectively remove portions of the selected regions for rectifying the error.