发明授权
- 专利标题: Coil inductor for on-chip or on-chip stack
- 专利标题(中): 用于片上或片上堆叠的线圈电感
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申请号: US13289071申请日: 2011-11-04
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公开(公告)号: US09105627B2公开(公告)日: 2015-08-11
- 发明人: Michael J. Shapiro , Gary D. Carpenter , Alan J. Drake , Rachel Gordin , Edmund J. Sprogis
- 申请人: Michael J. Shapiro , Gary D. Carpenter , Alan J. Drake , Rachel Gordin , Edmund J. Sprogis
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 L. Jeffrey Kelly; H. Daniel Schnurmann
- 主分类号: H01F5/00
- IPC分类号: H01F5/00 ; H01L27/08 ; H01L23/498 ; H01L23/522 ; H01L23/64 ; H01L49/02 ; H01F17/00 ; H01F41/00
摘要:
A coil inductor and buck voltage regulator incorporating the coil inductor are provided which can be fabricated on a microelectronic element such as a semiconductor chip, or on an interconnection element such as a semiconductor, glass or ceramic interposer element. When energized, the coil inductor has magnetic flux extending in a direction parallel to first and second opposed surfaces of the microelectronic or interconnection element, and whose peak magnetic flux is disposed between the first and second surfaces. In one example, the coil inductor can be formed by first conductive lines extending along the first surface of the microelectronic or interconnection element, second conductive lines extending along the second surface of the microelectronic or interconnection element, and a plurality of conductive vias, e.g., through silicon vias, extending in direction of a thickness of the microelectronic or interconnection element. A method of making the coil inductor is also provided.
公开/授权文献
- US20130113448A1 COIL INDUCTOR FOR ON-CHIP OR ON-CHIP STACK 公开/授权日:2013-05-09
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