Invention Grant
US09105644B2 Apparatus and method for forming alignment features for back side processing of a wafer
有权
用于形成用于晶片的背面处理的对准特征的装置和方法
- Patent Title: Apparatus and method for forming alignment features for back side processing of a wafer
- Patent Title (中): 用于形成用于晶片的背面处理的对准特征的装置和方法
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Application No.: US13948408Application Date: 2013-07-23
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Publication No.: US09105644B2Publication Date: 2015-08-11
- Inventor: Christine H. Tsau , William David Sawyer , Thomas Kieran Nunan
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Sunstein Kann Murphy & Timbers LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L23/544 ; H01L21/768 ; H01L21/78
Abstract:
A method for forming an alignment feature for back side wafer processing in a wafer fabrication process involves forming a trench into but not entirely through a wafer from a top side of the wafer; forming a contrasting material on surfaces of the trench; and grinding a bottom side of the wafer to expose the trench using the handling wafer to handle the wafer during such grinding, wherein the contrasting material lining the exposed trench provides an alignment reference for precise alignment of the wafer for back side processing the wafer.
Public/Granted literature
- US20150028499A1 Apparatus and Method for Forming Alignment Features for Back Side Processing of a Wafer Public/Granted day:2015-01-29
Information query
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