Invention Grant
- Patent Title: Semiconductor device having polysilicon mask layer
- Patent Title (中): 具有多晶硅掩模层的半导体器件
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Application No.: US13928002Application Date: 2013-06-26
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Publication No.: US09105667B2Publication Date: 2015-08-11
- Inventor: Guanru Lee
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW
- Agency: Baker & McKenzie LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/792 ; H01L29/66 ; H01L29/04 ; H01L27/108 ; H01L29/423 ; H01L21/311 ; H01L27/115

Abstract:
A semiconductor device includes a first semiconductor layer, a second semiconductor layer and a third semiconductor layer. The second semiconductor layer is formed over the first semiconductor layer and includes a recess in a vertical direction towards the first semiconductor layer. The third semiconductor layer is formed in the recess of the second semiconductor layer and includes a seam or void in the recess.
Public/Granted literature
- US20140264352A1 MASK LAYER AND METHOD OF FORMATION Public/Granted day:2014-09-18
Information query
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