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US09105667B2 Semiconductor device having polysilicon mask layer 有权
具有多晶硅掩模层的半导体器件

Semiconductor device having polysilicon mask layer
Abstract:
A semiconductor device includes a first semiconductor layer, a second semiconductor layer and a third semiconductor layer. The second semiconductor layer is formed over the first semiconductor layer and includes a recess in a vertical direction towards the first semiconductor layer. The third semiconductor layer is formed in the recess of the second semiconductor layer and includes a seam or void in the recess.
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