发明授权
- 专利标题： Pick-and-place tool for packaging process
- 专利标题（中）： 包装过程的拾取和放置工具
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申请号： US14040004申请日： 2013-09-27
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公开(公告)号： US09105760B2公开(公告)日： 2015-08-11
- 发明人: Chien Ling Hwang , Ying-Jui Huang , Yi-Li Hsiao
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L23/58 ; H01L23/00 ; H01L21/67
摘要：
An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops.
公开/授权文献
- US20140030849A1 Pick-and-Place Tool for Packaging Process 公开/授权日：2014-01-30
信息查询
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