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    Bonding method of package components and bonding apparatus
    1.
    发明授权
    Bonding method of package components and bonding apparatus 有权

    公开(公告)号：US11955378B2

    公开(公告)日：2024-04-09

    申请号：US17876556

    申请日：2022-07-29

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Yi-Li Hsiao ,  Chih-Hang Tung ,  Chen-Hua Yu ,  Tung-Liang Shao ,  Su-Chun Yang

    IPC分类号： H01L21/768 ,  H01L21/50 ,  H01L21/60

    CPC分类号： H01L21/76828 ,  H01L21/50 ,  H01L2021/60127

    摘要： A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

    Methods for Forming Apparatus for Stud Bump Formation
    5.
    发明申请
    Methods for Forming Apparatus for Stud Bump Formation 审中-公开
    螺栓形凸形成装置的方法

    公开(公告)号：US20150102091A1

    公开(公告)日：2015-04-16

    申请号：US14574593

    申请日：2014-12-18

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Yeong-Jyh Lin ,  Hsin-Hung Liao ,  Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

    IPC分类号： B23K31/02 ,  B23K20/00

    CPC分类号： B23K31/02 ,  B21D53/36 ,  B23K20/007 ,  H01L2224/78301 ,  Y10T29/49

    摘要： An apparatus used for forming stud bumps may be formed by providing a first clamp plate comprising a clamping surface, forming a notcher on the clamping surface, and forming a contact stopper on the clamping surface. The apparatus may include a clamp that includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method for forming stud bumps includes bonding wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface.

    摘要翻译： 用于形成支柱凸块的装置可以通过提供包括夹紧表面的第一夹板，在夹紧表面上形成刻痕器，并在夹紧表面上形成接触止动器来形成。 该装置可以包括夹具，该夹具包括至少两个相对的板，并且至少一个相对的板包括当线被夹紧形成线中的第一凹口时与线相交的突出特征。 用于形成支柱凸块的方法包括将线接合到接合表面，将线从夹具释放，使线通过钳口的切口间距距离，夹紧线夹在线中形成第二凹口，并断开线 在接合表面上留下线的接合部分。