Semiaromatic, semicrystalline copolyamide molding compositions, comprising A) from 35 to 100% by weight of a copolyamide composed of a1) from 35 to 69% by weight of units which derive from hexamethylenediamine and from an aromatic dicarboxylic acid having from 8 to 16 carbon atoms, a2) from 31 to 65% by weight of units which derive from 3,3′-dimethyl-4,4′-diaminodicyclohexylmethane and from terephthalic acid, a3) from 0 to 30% by weight of units of a semicrystalline polyamide different from a1) and a2), B) from 0 to 65% by weight of further additives, where the total of the percentages by weight of A) and B) is 100%.