Invention Grant
US09111664B2 Manufacturing method of enameled flat wire using die for flat wire coating
有权
搪瓷扁丝的制造方法使用模具进行平面丝网涂布
- Patent Title: Manufacturing method of enameled flat wire using die for flat wire coating
- Patent Title (中): 搪瓷扁丝的制造方法使用模具进行平面丝网涂布
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Application No.: US13939597Application Date: 2013-07-11
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Publication No.: US09111664B2Publication Date: 2015-08-18
- Inventor: Masayoshi Goto
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2010-002605 20100108
- Main IPC: B05D7/20
- IPC: B05D7/20 ; H01B13/16 ; H01B13/24 ; H01B7/08 ; C03C25/12 ; C03C25/18 ; H01B13/06 ; B05C1/04 ; B05C3/12

Abstract:
A manufacturing method uses a solid coating die for applying an insulation varnish around a flat wire conductor. The die includes a die body and a die hole formed through the die body, into which the conductor is inserted. The die hole includes an entry portion having a cross section monotonically decreasing along a conductor insertion direction, and a coating portion including at least a sub-portion having a constant cross section. The cross section of the coating portion is a rectangle having four straight sides and four rounded corners. Each inner surface of each straight side has an inwardly projecting protrusion, a top contour of each protrusion being a circular arc, an elongated circular arc, an elliptical arc or a combination of these arcs, the maximum curvature of the top contour of each protrusion being larger than the maximum curvature of inner surface of the rounded corners.
Public/Granted literature
- US20130300022A1 MANUFACTURING METHOD OF ENAMELED FLAT WIRE USING DIE FOR FLAT WIRE COATING Public/Granted day:2013-11-14
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