An integrated passives package includes an encapsulation compound and a plurality of electrically conductive pads embedded in the encapsulation compound. Each of the pads has opposing first and second sides. The first side of the pads is uncovered by the encapsulation compound and forms array of external electrical connections at a first side of the package. The integrated passives package further includes a plurality of passive components embedded in the encapsulation compound. Each of the passive components has a first terminal attached to one of the pads and a second terminal attached to a different one the pads at the second side of the pads. Corresponding semiconductor modules and methods of manufacturing are also provided.