Invention Grant
- Patent Title: Techniques for bonding substrates using an intermediate layer
- Patent Title (中): 使用中间层粘合基板的技术
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Application No.: US14447722Application Date: 2014-07-31
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Publication No.: US09120287B2Publication Date: 2015-09-01
- Inventor: David A Ruben , Michael S Sandlin
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Evans M. Mburu
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B32B7/04 ; H01L21/20 ; B32B17/06 ; H05K1/03 ; H05K1/11 ; H05K1/18
Abstract:
A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.
Public/Granted literature
- US20150022983A1 TECHNIQUES FOR BONDING SUBSTRATES USING AN INTERMEDIATE LAYER Public/Granted day:2015-01-22
Information query
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