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    Implantable medical device system including feedthrough assembly and method of forming same
    2.
    发明授权
    Implantable medical device system including feedthrough assembly and method of forming same 有权

    公开(公告)号：US09968794B2

    公开(公告)日：2018-05-15

    申请号：US14966279

    申请日：2015-12-11

    Applicant: Medtronic, Inc.

    Inventor： David A Ruben ,  Michael S Sandlin

    IPC: A61N1/375 ,  H05K3/32 ,  H05K3/42

    CPC classification number: A61N1/3754 ,  H05K3/32 ,  H05K3/42

    Abstract: Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    Feedthrough assemblies
    3.
    发明授权
    Feedthrough assemblies 有权

    公开(公告)号：US09865533B2

    公开(公告)日：2018-01-09

    申请号：US14966101

    申请日：2015-12-11

    Applicant: Medtronic, Inc.

    Inventor： David A Ruben ,  Michael S Sandlin

    IPC: H01L23/498 ,  H01L21/48 ,  A61N1/375

    CPC classification number: H01L23/49827 ,  A61N1/3754 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

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