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    Feedthrough assemblies
    1.
    发明授权
    Feedthrough assemblies 有权

    公开(公告)号：US09865533B2

    公开(公告)日：2018-01-09

    申请号：US14966101

    申请日：2015-12-11

    Applicant: Medtronic, Inc.

    Inventor： David A Ruben ,  Michael S Sandlin

    IPC: H01L23/498 ,  H01L21/48 ,  A61N1/375

    CPC classification number: H01L23/49827 ,  A61N1/3754 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

    Sealed package and method of forming same
    3.
    发明授权
    Sealed package and method of forming same 有权

    公开(公告)号：US10098589B2

    公开(公告)日：2018-10-16

    申请号：US15359974

    申请日：2016-11-23

    Applicant: Medtronic, Inc.

    Inventor： David A Ruben ,  Craig L Schmidt

    IPC: H05K5/06 ,  A61B5/00 ,  H05K5/02 ,  H05K1/18 ,  H05K1/11 ,  H05K5/03 ,  H05K3/40 ,  H05K3/32 ,  H05K3/00 ,  A61B5/0245 ,  A61N1/05

    Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

    Power source and method of forming same
    6.
    发明授权
    Power source and method of forming same 有权

    公开(公告)号：US10290757B2

    公开(公告)日：2019-05-14

    申请号：US15252398

    申请日：2016-08-31

    Applicant: Medtronic, Inc.

    Inventor： Andreas A Fenner ,  David A Ruben ,  Jennifer Lorenz Marckmann ,  James R Wasson

    IPC: G21H1/12 ,  H01L35/04 ,  H01L31/055 ,  H01L31/16 ,  H01L31/054

    Abstract: Various embodiments of a power source and method of forming such power source are disclosed. The power source can include a substrate and a cavity disposed in a first major surface of the substrate. The power source can also include radioactive material disposed within the cavity, where the radioactive material emits radiation particles; and particle converting material disposed within the cavity, where the particle converting material converts one or more radiation particles emitted by the radioactive material into light. The power source further includes a sealing layer disposed such that the particle converting material and the radioactive material are hermetically sealed within the cavity, and a photovoltaic device disposed adjacent the substrate. The photovoltaic device can convert at least a portion of the light emitted by the particle converting material that is incident upon an input surface of the photovoltaic device into electrical energy.

    Power source and method of forming same
    7.
    发明授权
    Power source and method of forming same 有权

    公开(公告)号：US10580544B2

    公开(公告)日：2020-03-03

    申请号：US15427152

    申请日：2017-02-08

    Applicant: Medtronic, Inc.

    Inventor： Andreas Fenner ,  Jennifer Lorenz Marckmann ,  David A Ruben ,  James R Wasson

    IPC: H01L31/055 ,  H01L31/054 ,  G21H1/12

    Abstract: Various embodiments of a power source and a method of forming such power source are disclosed. The power source can include an enclosure, a substrate disposed within the enclosure, and radioactive material disposed within the substrate and adapted to emit radioactive particles. The power source can further include a diffusion barrier disposed over an outer surface of the substrate, and a carrier material disposed within the enclosure, where the carrier material includes an oxide material.

    Implantable medical device system including feedthrough assembly and method of forming same
    8.
    发明授权
    Implantable medical device system including feedthrough assembly and method of forming same 有权

    公开(公告)号：US09968794B2

    公开(公告)日：2018-05-15

    申请号：US14966279

    申请日：2015-12-11

    Applicant: Medtronic, Inc.

    Inventor： David A Ruben ,  Michael S Sandlin

    IPC: A61N1/375 ,  H05K3/32 ,  H05K3/42

    CPC classification number: A61N1/3754 ,  H05K3/32 ,  H05K3/42

    Abstract: Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

    Hermetically-sealed packages including feedthrough assemblies
    9.
    发明授权
    Hermetically-sealed packages including feedthrough assemblies 有权

    公开(公告)号：US10136535B2

    公开(公告)日：2018-11-20

    申请号：US14966181

    申请日：2015-12-11

    Applicant: Medtronic, Inc.

    Inventor： David A Ruben

    IPC: A61N1/375 ,  H05K5/06 ,  H05K3/38 ,  H05K7/06

    Abstract: Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

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