Invention Grant
- Patent Title: Decoupling capacitor and method of making same
- Patent Title (中): 去耦电容及其制作方法
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Application No.: US14178383Application Date: 2014-02-12
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Publication No.: US09123556B2Publication Date: 2015-09-01
- Inventor: Chung-Hui Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L23/522 ; H01L49/02 ; H01L23/528 ; H01L29/66 ; H01L29/06 ; H01L21/762 ; H01L27/02

Abstract:
A semiconductor substrate has at least two active regions, each having at least one active device that includes a gate electrode layer, and a shallow trench isolation (STI) region between the active regions. A decoupling capacitor comprises first and second dummy conductive patterns formed in the same gate electrode layer over the STI region. The first and second dummy conductive regions are unconnected to any of the at least one active device. The first dummy conductive pattern is connected to a source of a first potential. The second dummy conductive pattern is connected to a source of a second potential. A dielectric material is provided between the first and second dummy conductive patterns.
Public/Granted literature
- US20140159195A1 DECOUPLING CAPACITOR AND METHOD OF MAKING SAME Public/Granted day:2014-06-12
Information query
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